ZHCSS26F november   1998  – october 2020

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics for TPS3705-33 Only
    7. 7.7  Timing Requirements
    8. 7.8  Switching Characteristics
    9. 7.9  Dissipation Ratings
    10. 7.10 Timing Diagram
    11. 7.11 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Manual Reset Input
      2. 8.3.2 Power-Fail Comparator
      3. 8.3.3 Watchdog Timer
    4. 8.4 Device Functional Modes
      1. 8.4.1 VDD < 1.1 V
      2. 8.4.2 1.1 V < VDD ≤ 2 V
      3. 8.4.3 2 V < VDD < 6 V
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) TPS3705-xx TPS3707-xx UNIT
D (SOIC) DGN (MSOP-PowerPAD)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 118.2 66.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 64.4 62.6 °C/W
RθJB Junction-to-board thermal resistance 58.5 45.1 °C/W
ψJT Junction-to-top characterization parameter 15.8 7.6 °C/W
ψJB Junction-to-board characterization parameter 57.9 44.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 18.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.