ZHCSJB4D April   2019  – January 2024 TAS2563

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  I2C Timing Requirements
    7. 5.7  SPI Timing Requirements
    8. 5.8  PDM Port Timing Requirements
    9. 5.9  TDM Port Timing Requirements
    10. 5.10 Timing Diagrams
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PurePath Console 3 Software
      2. 7.3.2  Device Mode and Address Selection
      3. 7.3.3  General I2C Operation
      4. 7.3.4  General SPI Operation
      5. 7.3.5  Single-Byte and Multiple-Byte Transfers
      6. 7.3.6  Single-Byte Write
      7. 7.3.7  Multiple-Byte Write and Incremental Multiple-Byte Write
      8. 7.3.8  Single-Byte Read
      9. 7.3.9  Multiple-Byte Read
      10. 7.3.10 Register Organization
      11. 7.3.11 Operational Modes
        1. 7.3.11.1 Hardware Shutdown
        2. 7.3.11.2 Software Shutdown
        3. 7.3.11.3 Mute
        4. 7.3.11.4 Active
        5. 7.3.11.5 Perform Load Diagnostics
        6. 7.3.11.6 Mode Control and Software Reset
      12. 7.3.12 Faults and Status
      13. 7.3.13 Digital Input Pull Downs
    4. 7.4 Device Functional Modes
      1. 7.4.1 PDM Input
      2. 7.4.2 TDM Port
      3. 7.4.3 Playback Signal Path
        1. 7.4.3.1 Digital Signal Processor
        2. 7.4.3.2 High Pass Filter
        3. 7.4.3.3 Digital Volume Control and Amplifier Output Level
        4. 7.4.3.4 Auto-mute During Idle Channel Mode
        5. 7.4.3.5 Auto-start/stop on Audio Clocks
        6. 7.4.3.6 Supply Tracking Limiters with Brown Out Prevention
        7. 7.4.3.7 Class-D Settings
      4. 7.4.4 SAR ADC
      5. 7.4.5 Boost
      6. 7.4.6 IV Sense
      7. 7.4.7 Load Diagnostics
      8. 7.4.8 Clocks and PLL
      9. 7.4.9 Thermal Foldback
    5. 7.5 Register Maps
      1. 7.5.1  Register Summary Table Page=0x00
      2. 7.5.2  PAGE (page=0x00 address=0x00) [reset=0h]
      3. 7.5.3  SW_RESET (page=0x00 address=0x01) [reset=0h]
      4. 7.5.4  PWR_CTL (page=0x00 address=0x02) [reset=Eh]
      5. 7.5.5  PB_CFG1 (page=0x00 address=0x03) [reset=20h]
      6. 7.5.6  MISC_CFG1 (page=0x00 address=0x04) [reset=C6h]
      7. 7.5.7  MISC_CFG2 (page=0x00 address=0x05) [reset=22h]
      8. 7.5.8  TDM_CFG0 (page=0x00 address=0x06) [reset=9h]
      9. 7.5.9  TDM_CFG1 (page=0x00 address=0x07) [reset=2h]
      10. 7.5.10 TDM_CFG2 (page=0x00 address=0x08) [reset=4Ah]
      11. 7.5.11 TDM_CFG3 (page=0x00 address=0x09) [reset=10h]
      12. 7.5.12 TDM_CFG4 (page=0x00 address=0x0A) [reset=13h]
      13. 7.5.13 TDM_CFG5 (page=0x00 address=0x0B) [reset=2h]
      14. 7.5.14 TDM_CFG6 (page=0x00 address=0x0C) [reset=0h]
      15. 7.5.15 TDM_CFG7 (page=0x00 address=0x0D) [reset=4h]
      16. 7.5.16 TDM_CFG8 (page=0x00 address=0x0E) [reset=5h]
      17. 7.5.17 TDM_CFG9 (page=0x00 address=0x0F) [reset=6h]
      18. 7.5.18 TDM_CFG10 (page=0x00 address=0x10) [reset=7h]
      19. 7.5.19 DSP Mode & TDM_DET (page=0x00 address=0x11) [reset=7Fh]
      20. 7.5.20 LIM_CFG0 (page=0x00 address=0x12) [reset=12h]
      21. 7.5.21 LIM_CFG1 (page=0x00 address=0x13) [reset=76h]
      22. 7.5.22 DSP FREQUENCY & BOP_CFG0 (page=0x00 address=0x14) [reset=1h]
      23. 7.5.23 BOP_CFG0 (page=0x00 address=0x15) [reset=2Eh]
      24. 7.5.24 BIL_and_ICLA_CFG0 (page=0x00 address=0x16) [reset=60h]
      25. 7.5.25 BIL_ICLA_CFG1 (page=0x00 address=0x17) [reset=0h]
      26. 7.5.26 GAIN_ICLA_CFG0 (page=0x00 address=0x18) [reset=0h]
      27. 7.5.27 ICLA_CFG1 (page=0x00 address=0x19) [reset=0h]
      28. 7.5.28 INT_MASK0 (page=0x00 address=0x1A) [reset=FCh]
      29. 7.5.29 INT_MASK1 (page=0x00 address=0x1B) [reset=A6h]
      30. 7.5.30 INT_MASK2 (page=0x00 address=0x1C) [reset=DFh]
      31. 7.5.31 INT_MASK3 (page=0x00 address=0x1D) [reset=FFh]
      32. 7.5.32 INT_LIVE0 (page=0x00 address=0x1F) [reset=0h]
      33. 7.5.33 INT_LIVE1 (page=0x00 address=0x20) [reset=0h]
      34. 7.5.34 INT_LIVE3 (page=0x00 address=0x21) [reset=0h]
      35. 7.5.35 INT_LIVE4 (page=0x00 address=0x22) [reset=0h]
      36. 7.5.36 INT_LTCH0 (page=0x00 address=0x24) [reset=0h]
      37. 7.5.37 INT_LTCH1 (page=0x00 address=0x25) [reset=0h]
      38. 7.5.38 INT_LTCH3 (page=0x00 address=0x26) [reset=0h]
      39. 7.5.39 INT_LTCH4 (page=0x00 address=0x27) [reset=0h]
      40. 7.5.40 VBAT_MSB (page=0x00 address=0x2A) [reset=0h]
      41. 7.5.41 VBAT_LSB (page=0x00 address=0x2B) [reset=0h]
      42. 7.5.42 TEMP (page=0x00 address=0x2C) [reset=0h]
      43. 7.5.43 INT & CLK CFG (page=0x00 address=0x30) [reset=19h]
      44. 7.5.44 DIN_PD (page=0x00 address=0x31) [reset=40h]
      45. 7.5.45 MISC (page=0x00 address=0x32) [reset=80h]
      46. 7.5.46 BOOST_CFG1 (page=0x00 address=0x33) [reset=34h]
      47. 7.5.47 BOOST_CFG2 (page=0x00 address=0x34) [reset=4Bh]
      48. 7.5.48 BOOST_CFG3 (page=0x00 address=0x35) [reset=74h]
      49. 7.5.49 MISC (page=0x00 address=0x3B) [reset=58h]
      50. 7.5.50 TG_CFG0 (page=0x00 address=0x3F) [reset=0h]
      51. 7.5.51 BST_ILIM_CFG0 (page=0x00 address=0x40) [reset=36h]
      52. 7.5.52 PDM_CONFIG0 (page=0x00 address=0x41) [reset=1h]
      53. 7.5.53 DIN_PD & PDM_CONFIG3 (page=0x00 address=0x42) [reset=F8h]
      54. 7.5.54 ASI2_CONFIG0 (page=0x00 address=0x43) [reset=8h]
      55. 7.5.55 ASI2_CONFIG1 (page=0x00 address=0x44) [reset=0h]
      56. 7.5.56 ASI2_CONFIG2 (page=0x00 address=0x45) [reset=1h]
      57. 7.5.57 ASI2_CONFIG3 (page=0x00 address=0x46) [reset=FCh]
      58. 7.5.58 PVDD_MSB_DSP (page=0x00 address=0x49) [reset=0h]
      59. 7.5.59 PVDD_LSB_DSP (page=0x00 address=0x4A) [reset=0h]
      60. 7.5.60 REV_ID (page=0x00 address=0x7D) [reset=0h]
      61. 7.5.61 I2C_CKSUM (page=0x00 address=0x7E) [reset=0h]
      62. 7.5.62 BOOK (page=0x00 address=0x7F) [reset=0h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Mono/Stereo Configuration
        2. 8.2.2.2 Boost Converter Passive Devices
        3. 8.2.2.3 EMI Passive Devices
        4. 8.2.2.4 Miscellaneous Passive Devices
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
    1. 9.1 Power Supplies
    2. 9.2 Power Supply Sequencing
      1. 9.2.1 Boost Supply Details
      2. 9.2.2 External Boost Mode (Boost Bypass Mode)
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YBG|42
  • RPP|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4.5 Boost

The TAS2563 internal processing algorithm automatically enables the boost when needed. A look-ahead algorithm monitors the battery voltage and the digital audio stream. When the speaker output approaches the battery voltage the boost is enabled in-time to supply the required speaker output voltage. When the boost is no longer required it is disabled and bypassed to maximize efficiency. The boost can be configured in one of two modes. The first is low in-rush (Class-G) supporting only boost on-off and has the lowest in-rush current. The second is high-efficiency (Class-H) where the boost voltage level is adjusted to a value just above what is needed. This mode is more efficient but has a higher in-rush current to quickly transition the levels. This can be configured using Table 7-79.

GUID-D9E526B6-DEEB-40D7-B320-FFD32D6032C9-low.gifFigure 7-19 Boost Mode Signal Tracking Example
Table 7-79 Boost Mode
BST_MODE[1:0]BOOST MODE
00
Class-H - High efficiency (default)
01
Class-G - Low in-rush
10
Always On
11
Always Off - Pass-throught

The boost can be enabled and disabled using BST_EN register. When driving the Class-D amplifier using an external supply through the PVDD pin, the boost should be disabled and the VBST pin can be left floating. Do not drive an external voltage on the VBST pin. When suppling and external PVDD voltage the VBAT voltage must also be supplied to the device. While VBAT supply must be present it will not carry current to the speaker load.

Table 7-80 Boost Enable
BST_ENBOOST IS
0
Disabled
1
Enabled (default)
Table 7-81 Active Mode PFM Lower Frequency Limit
BST_PFML[1:0]LOWER LIMIT (Hz)
00
No lower limit
01
25 kHz
10
50 kHz (default)
11
100 kHz

The boost has a soft-start to limit in-rush current during the initial charge. The current limit and soft-start timer are configurable to adjust to system component selection.

Table 7-82 Soft-Start Current Limit
BST_SSL[1:0]CURRENT LIMIT (A)
00
Disabled - Boost Normal Limit
01
1.0 A
10
1.5 A (default)
11
2 A
Table 7-83 Class-G Soft-Start Timer
BST_GSST[1:0]TIMEOUT (s)
00
1 * BST_HSTT
01
2 * BST_HSTT
10
4 * BST_HSTT(default)
11
8 * BST_HSTT
Table 7-84 Class-H Soft-Start Timer
BST_HSST[3:0]TIMEOUT (s)
0x0
9 µS
0x1
18 µS
0x2
36 µS
0x3
54 µS
0x4
72 µS
0x5
90 µS
0x6
108 µS
0x7
135 µS (default)
0x8
162 µS
0x9
198 µS
0xA
252 µS
0xB
342 µS
0xC
477 µS
0xD
612 µS
0xE
792 µS
0xF
990 µS

The boost inductor and decoupling capacitor range needs to be specified using BST_IR and BST_CR registers. These setting optimize the boost to ensure current limit accuracy and avoid clipping in class-H operation.

Table 7-85 Boost Inductor Range
BST_IR[1:0]INDUCTANCE (H)
00
< 0.6 µH
01
0.6 µH-1.3 µH (default)
10
1.3 µH - 2.5 µH
11
Reserved
Table 7-86 Boost Load Regulation
BST_LRVALUE
00
Reserved
01
3 A/V; load regulation = 1V (default)
10
2 A/V; load regulation = 1.5 V
11
Reserved

The maximum boost voltage regulation is set by BST_VREG. When operating in class-G mode the boost when needed will be at this voltage. In class-H mode of operation the boost voltage is automatically selected based on the audio signal but, will not exceed this set value.

The peak current limits the boost current drawn from the VBAT supply. This setting allows flexibility in the inductor selection for various saturation currents. The current limit can be adjust in 45 mA steps with register BST_ILIM[5:0]. The peak current limit setting is the maximum and may be temporarily reduced if the ICLA current limit is active.

Table 7-87 Peak Current Limit
BST_ILIM[5:0]CURRENT (A)
0x00
0.99 A
0x01
1.045 A
0x02
1.1 A
...
...
0x36
3.96 A (default)
0x37
4 A
0x38-0x3F
Reserved

For multiple parts the TAS2563 can shift the boost phase to ensure each device will contribute to the load sharing. The boost syncing among multiple devices is enabled using BST_SYNC and then each part is configured to be on 0 or 180 phase using BST_PA. This avoids peak current align on and clock edges and spreads out battery ripple. The phase of additional devices can be set relative to the master using register BST_PA[1:0]. The phase align is performed over the Inter-chip Communication (ICC) bus and a slot for this feature needs to be configured if enabled.

Table 7-88 Boost Sync
BST_SYNC
0
Not Synced (default)
1
Synced to FSYNC
Table 7-89 Boost Phase
BST_PA[0]PHASE (Deg)
0
~0° (default)
1
~180°