ZHCSJB4D April   2019  – January 2024 TAS2563

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  I2C Timing Requirements
    7. 5.7  SPI Timing Requirements
    8. 5.8  PDM Port Timing Requirements
    9. 5.9  TDM Port Timing Requirements
    10. 5.10 Timing Diagrams
    11. 5.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PurePath Console 3 Software
      2. 7.3.2  Device Mode and Address Selection
      3. 7.3.3  General I2C Operation
      4. 7.3.4  General SPI Operation
      5. 7.3.5  Single-Byte and Multiple-Byte Transfers
      6. 7.3.6  Single-Byte Write
      7. 7.3.7  Multiple-Byte Write and Incremental Multiple-Byte Write
      8. 7.3.8  Single-Byte Read
      9. 7.3.9  Multiple-Byte Read
      10. 7.3.10 Register Organization
      11. 7.3.11 Operational Modes
        1. 7.3.11.1 Hardware Shutdown
        2. 7.3.11.2 Software Shutdown
        3. 7.3.11.3 Mute
        4. 7.3.11.4 Active
        5. 7.3.11.5 Perform Load Diagnostics
        6. 7.3.11.6 Mode Control and Software Reset
      12. 7.3.12 Faults and Status
      13. 7.3.13 Digital Input Pull Downs
    4. 7.4 Device Functional Modes
      1. 7.4.1 PDM Input
      2. 7.4.2 TDM Port
      3. 7.4.3 Playback Signal Path
        1. 7.4.3.1 Digital Signal Processor
        2. 7.4.3.2 High Pass Filter
        3. 7.4.3.3 Digital Volume Control and Amplifier Output Level
        4. 7.4.3.4 Auto-mute During Idle Channel Mode
        5. 7.4.3.5 Auto-start/stop on Audio Clocks
        6. 7.4.3.6 Supply Tracking Limiters with Brown Out Prevention
        7. 7.4.3.7 Class-D Settings
      4. 7.4.4 SAR ADC
      5. 7.4.5 Boost
      6. 7.4.6 IV Sense
      7. 7.4.7 Load Diagnostics
      8. 7.4.8 Clocks and PLL
      9. 7.4.9 Thermal Foldback
    5. 7.5 Register Maps
      1. 7.5.1  Register Summary Table Page=0x00
      2. 7.5.2  PAGE (page=0x00 address=0x00) [reset=0h]
      3. 7.5.3  SW_RESET (page=0x00 address=0x01) [reset=0h]
      4. 7.5.4  PWR_CTL (page=0x00 address=0x02) [reset=Eh]
      5. 7.5.5  PB_CFG1 (page=0x00 address=0x03) [reset=20h]
      6. 7.5.6  MISC_CFG1 (page=0x00 address=0x04) [reset=C6h]
      7. 7.5.7  MISC_CFG2 (page=0x00 address=0x05) [reset=22h]
      8. 7.5.8  TDM_CFG0 (page=0x00 address=0x06) [reset=9h]
      9. 7.5.9  TDM_CFG1 (page=0x00 address=0x07) [reset=2h]
      10. 7.5.10 TDM_CFG2 (page=0x00 address=0x08) [reset=4Ah]
      11. 7.5.11 TDM_CFG3 (page=0x00 address=0x09) [reset=10h]
      12. 7.5.12 TDM_CFG4 (page=0x00 address=0x0A) [reset=13h]
      13. 7.5.13 TDM_CFG5 (page=0x00 address=0x0B) [reset=2h]
      14. 7.5.14 TDM_CFG6 (page=0x00 address=0x0C) [reset=0h]
      15. 7.5.15 TDM_CFG7 (page=0x00 address=0x0D) [reset=4h]
      16. 7.5.16 TDM_CFG8 (page=0x00 address=0x0E) [reset=5h]
      17. 7.5.17 TDM_CFG9 (page=0x00 address=0x0F) [reset=6h]
      18. 7.5.18 TDM_CFG10 (page=0x00 address=0x10) [reset=7h]
      19. 7.5.19 DSP Mode & TDM_DET (page=0x00 address=0x11) [reset=7Fh]
      20. 7.5.20 LIM_CFG0 (page=0x00 address=0x12) [reset=12h]
      21. 7.5.21 LIM_CFG1 (page=0x00 address=0x13) [reset=76h]
      22. 7.5.22 DSP FREQUENCY & BOP_CFG0 (page=0x00 address=0x14) [reset=1h]
      23. 7.5.23 BOP_CFG0 (page=0x00 address=0x15) [reset=2Eh]
      24. 7.5.24 BIL_and_ICLA_CFG0 (page=0x00 address=0x16) [reset=60h]
      25. 7.5.25 BIL_ICLA_CFG1 (page=0x00 address=0x17) [reset=0h]
      26. 7.5.26 GAIN_ICLA_CFG0 (page=0x00 address=0x18) [reset=0h]
      27. 7.5.27 ICLA_CFG1 (page=0x00 address=0x19) [reset=0h]
      28. 7.5.28 INT_MASK0 (page=0x00 address=0x1A) [reset=FCh]
      29. 7.5.29 INT_MASK1 (page=0x00 address=0x1B) [reset=A6h]
      30. 7.5.30 INT_MASK2 (page=0x00 address=0x1C) [reset=DFh]
      31. 7.5.31 INT_MASK3 (page=0x00 address=0x1D) [reset=FFh]
      32. 7.5.32 INT_LIVE0 (page=0x00 address=0x1F) [reset=0h]
      33. 7.5.33 INT_LIVE1 (page=0x00 address=0x20) [reset=0h]
      34. 7.5.34 INT_LIVE3 (page=0x00 address=0x21) [reset=0h]
      35. 7.5.35 INT_LIVE4 (page=0x00 address=0x22) [reset=0h]
      36. 7.5.36 INT_LTCH0 (page=0x00 address=0x24) [reset=0h]
      37. 7.5.37 INT_LTCH1 (page=0x00 address=0x25) [reset=0h]
      38. 7.5.38 INT_LTCH3 (page=0x00 address=0x26) [reset=0h]
      39. 7.5.39 INT_LTCH4 (page=0x00 address=0x27) [reset=0h]
      40. 7.5.40 VBAT_MSB (page=0x00 address=0x2A) [reset=0h]
      41. 7.5.41 VBAT_LSB (page=0x00 address=0x2B) [reset=0h]
      42. 7.5.42 TEMP (page=0x00 address=0x2C) [reset=0h]
      43. 7.5.43 INT & CLK CFG (page=0x00 address=0x30) [reset=19h]
      44. 7.5.44 DIN_PD (page=0x00 address=0x31) [reset=40h]
      45. 7.5.45 MISC (page=0x00 address=0x32) [reset=80h]
      46. 7.5.46 BOOST_CFG1 (page=0x00 address=0x33) [reset=34h]
      47. 7.5.47 BOOST_CFG2 (page=0x00 address=0x34) [reset=4Bh]
      48. 7.5.48 BOOST_CFG3 (page=0x00 address=0x35) [reset=74h]
      49. 7.5.49 MISC (page=0x00 address=0x3B) [reset=58h]
      50. 7.5.50 TG_CFG0 (page=0x00 address=0x3F) [reset=0h]
      51. 7.5.51 BST_ILIM_CFG0 (page=0x00 address=0x40) [reset=36h]
      52. 7.5.52 PDM_CONFIG0 (page=0x00 address=0x41) [reset=1h]
      53. 7.5.53 DIN_PD & PDM_CONFIG3 (page=0x00 address=0x42) [reset=F8h]
      54. 7.5.54 ASI2_CONFIG0 (page=0x00 address=0x43) [reset=8h]
      55. 7.5.55 ASI2_CONFIG1 (page=0x00 address=0x44) [reset=0h]
      56. 7.5.56 ASI2_CONFIG2 (page=0x00 address=0x45) [reset=1h]
      57. 7.5.57 ASI2_CONFIG3 (page=0x00 address=0x46) [reset=FCh]
      58. 7.5.58 PVDD_MSB_DSP (page=0x00 address=0x49) [reset=0h]
      59. 7.5.59 PVDD_LSB_DSP (page=0x00 address=0x4A) [reset=0h]
      60. 7.5.60 REV_ID (page=0x00 address=0x7D) [reset=0h]
      61. 7.5.61 I2C_CKSUM (page=0x00 address=0x7E) [reset=0h]
      62. 7.5.62 BOOK (page=0x00 address=0x7F) [reset=0h]
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Mono/Stereo Configuration
        2. 8.2.2.2 Boost Converter Passive Devices
        3. 8.2.2.3 EMI Passive Devices
        4. 8.2.2.4 Miscellaneous Passive Devices
      3. 8.2.3 Application Curves
  10. Power Supply Recommendations
    1. 9.1 Power Supplies
    2. 9.2 Power Supply Sequencing
      1. 9.2.1 Boost Supply Details
      2. 9.2.2 External Boost Mode (Boost Bypass Mode)
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YBG|42
  • RPP|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

TAS2563 是一款经过优化、可将高峰值功率高效地驱动到小型扬声器的数字输入 D 级音频放大器。该 D 类放大器能够在 3.6V 的电池电压下使用集成式 11.5V H 类升压功能将 6.1W 峰值功率提供给 4Ω 负载,或在升压旁路模式下使用外部 12V 电源将 10W 峰值功率提供给 4Ω 负载。

片上低延迟 DSP 支持德州仪器 (TI) 的 SmartAmp 扬声器保护算法。集成的电流和电压检测功能可对扬声器进行实时监测,从而在改变峰值声压级 (SPL) 的同时保持扬声器不受损坏。

集成的超前 H 级升压功能可在播放期间动态调整升压电压,从而提高电池供电型系统的效率并延长电池寿命。对于稳压壁式供电型系统,TAS2563 还具有升压旁路模式,支持高达 16V 的电源电压以实现更高的输出功率。

两个 PDM 麦克风输入简化了双向音频系统的音频信号链,能够将数字麦克风与主机处理器连接起来。电池跟踪峰值电压限制器具有欠压保护功能,可以优化放大器在整个充电周期中的余量,从而防止系统关断。

器件信息(1)
器件型号封装封装尺寸(标称值)
TAS2563DSBGA 2.5mm × 3mm
TAS2563QFN4.5mm x 4mm
如需了解所有可用封装,请参阅数据表末尾的可订购产品附录。
GUID-EC119251-1BF4-4DD3-BC3C-EE2416568268-low.gif简化版原理图