ZHCSIJ4M December   1997  – July 2018 SN74CBTLV3257

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
    1.     Device Images
      1.      简化原理图（每个 FET 开关）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • DBQ|16
  • RGY|16
  • D|16
  • DGV|16
  • RSV|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

D, DBQ, DGV, and PW Package
16-Pin SOIC, SSOP, TVSOP, and TSSOP
(Top View)
RGY Package
16-Pin VQFN
(Top View)
RSV Package
16-Pin UQFN
(Top View)

Pin Functions

PIN I/O DESCRIPTION
NAME SOIC, SSOP, TVSOP, TSSOP, VQFN UQFN
1A 4 2 I/O Channel 1 out/in common
1B1 2 16 I/O Channel 1 in/out 1
1B2 3 1 I/O Channel 1 in/out 2
2A 7 5 I/O Channel 2 out/in common
2B1 5 3 I/O Channel 2 in/out 1
2B2 6 4 I/O Channel 2 in/out 2
3A 9 7 I/O Channel 3 out/in common
3B1 11 9 I/O Channel 3 in/out 1
3B2 10 8 I/O Channel 3 in/out 2
4A 12 10 I/O Channel 4 out/in common
4B1 14 12 I/O Channel 4 in/out 1
4B2 13 11 I/O Channel 4 in/out 2
GND 8 6 — Ground
OE 15 13 I Output Enable, active low
S 1 15 I Select
VCC 16 14 — Power