ZHCSQD2I February   1994  – October 2022 SN55LBC180 , SN65LBC180 , SN75LBC180

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 说明（续）
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Dissipation Rating Table
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information Table
    5. 6.5 Driver Section
      1. 6.5.1 Electrical Characteristics
      2. 6.5.2 Switching Characteristics
      3. 6.5.3 Switching Characteristics: SN55LBC180
    6. 6.6 Receiver Section
      1. 6.6.1 Electrical Characteristics
      2. 6.6.2 Switching Characteristics
      3. 6.6.3 Switching Characteristics: SN55LBC180
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Function Tables
    2. 8.2 Schematics of Inputs and Outputs
  9. 9 Application and Implementation
    1. 9.1 Application Information
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 商标
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • RSA|16
  • N|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information Table

THERMAL METRIC(1)D (SOIC)N (PDIP)RSA (QFN)UNIT
14 Pins14 Pins16 Pins
R θJAJunction-to-ambient thermal resistance93.253.438.7°C/W
R θJC(top)Junction-to-case (top) thermal resistance47.540.035.6°C/W
R θJBJunction-to-board thermal resistance49.433.217.5°C/W
ψ JTJunction-to-top characterization parameter11.219.01.1°C/W
ψ JBJunction-to-board characterization parameter48.932.917.5°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistancen/an/a7.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.