ZHCSJK2O October   2004  – September 2023 PCA9306

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics AC Performance (Translating Down) (EN = 3.3 V)
    7. 6.7  Switching Characteristics AC Performance (Translating Down) (EN = 2.5 V)
    8. 6.8  Switching Characteristics AC Performance (Translating Up) (EN = 3.3 V)
    9. 6.9  Switching Characteristics AC Performance (Translating Up) (EN = 2.5 V)
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Definition of threshold voltage
      2. 8.1.2 Correct Device Set Up
      3. 8.1.3 Disconnecting an I2C target from the Main I2C Bus Using the EN Pin
      4. 8.1.4 Supporting Remote Board Insertion to Backplane with PCA9306
      5. 8.1.5 Switch Configuration
      6. 8.1.6 Controller on Side 1 or Side 2 of Device
      7. 8.1.7 LDO and PCA9306 Concerns
      8. 8.1.8 Current Limiting Resistance on VREF2
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable (EN) Pin
      2. 8.3.2 Voltage Translation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 General Applications of I2C
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bidirectional Voltage Translation
        2. 9.2.2.2 Sizing Pullup Resistors
        3. 9.2.2.3 PCA9306 Bandwidth
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 支持资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  14.   Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision N (October 2021) to Revision O (September 2023)

  • 将“器件信息”表更改为封装信息 表Go
  • Changed the Thermal Information table values for the DQE packageGo

Changes from Revision M (April 2019) to Revision N (October 2021)

  • 将提到 I2C 的旧术语实例全局更改为控制器和目标Go
  • Changed the Thermal Information table values for the DCT and DCU packagesGo
  • Changed the MIN and MAX values of VIK in the Electrical Characteristics tableGo
  • Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Down) (EN = 3.3 V) tableGo
  • Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Down) (EN = 2.5 V) tableGo
  • Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Up) (EN = 3.3 V) tableGo
  • Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Up) (EN = 2.5 V) tableGo

Changes from Revision L (April 2016) to Revision M (April 2019)

  • Changed the DQE package family From: VSSON to X2SONGo
  • Added new section to Overview Go
  • Changed the labels in Figure 9-4. The red curve is > 2 V, the black curve is ≤ 2 V. Go

Changes from Revision K (October 2014) to Revision L (April 2016)

  • 将“导通状态连接”更改为“导通状态电阻”Go
  • 删除了机器模型 ESD 等级Go
  • 在说明 部分最后一句的“100kHz”后增加了“总线”Go
  • 更改了器件信息 表中的封装尺寸Go
  • Replaced pinout diagramsGo
  • Added I/O column to the Pin Functions table Go
  • Deleted RVH package from Pin Configuration and Functions section Go
  • Moved Tstg from Handling Ratings to Absolute Maximum Ratings Go
  • Added a note following the Electrical Characteristics tableGo
  • Added Figure 7-1 to the Parameter Measurement Information sectionGo
  • Changed Figure 7-2 Go
  • Changed "repeater" to "level shifter" in second paragraph of the Overview section Go
  • Deleted the last row of the Design Requirements table. Go
  • Corrected equation from fknee= 0.5 / RT (10%–80%) to fknee= 0.5 / RT (10%–90%)Go

Changes from Revision J (October 2010) to Revision K (December 2012)

  • 添加了引脚配置和功能 部分、处理等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go