ZHCSHN2B February   2010  – February 2018 LM48580

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VDD = 3.6 V
    6. 6.6 Typical Performance Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Class H Operation
      2. 8.3.2 Properties of Piezoelectric Elements
      3. 8.3.3 Differential Amplifier Explanation
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Gain Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Function
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Proper Selection of External Components
          1. 9.2.1.1.1 Boost Converter Capacitor Selection
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Boost Converter Output Capacitor Selection
          1. 9.2.2.1.1 Inductor Selection
          2. 9.2.2.1.2 Diode Selection
        2. 9.2.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 第三方产品免责声明
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

  • Minimize trace impedance of the power, ground and all output traces for optimum performance.
  • Voltage loss due to trace resistance between the LM48580 and the load results in decreased output power and efficiency.
  • Trace resistance between the power supply and ground has the same effect as a poorly regulated supply, increased ripple and reduced peak output power.
  • Use wide traces for power supply inputs and amplifier outputs to minimize losses due to trace resistance, as well as route heat away from the device.
  • Proper grounding improves audio performance, minimizes crosstalk between channels and prevents switching noise from interfering with the audio signal.
  • Use of power and ground planes is recommended.

Place all digital components and route digital signal traces as far as possible from analog components and traces. Do not run digital and analog traces in parallel on the same PCB layer. If digital and analog signal lines must cross either over or under each other, ensure that they cross in a perpendicular fashion.