ZHCSF89B June   2011  – June 2016 LM3559

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements (SCL, SDA)
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Amplifier Synchronization (TX1)
      2. 7.3.2  Input Voltage Flash Monitor Fault
      3. 7.3.3  Independent LED Control
      4. 7.3.4  Hardware Torch
      5. 7.3.5  Fault Protections
        1. 7.3.5.1 Overvoltage Protection
        2. 7.3.5.2 Current Limit
        3. 7.3.5.3 Flash Timeout
        4. 7.3.5.4 Indicator LED/Thermistor (LEDI/NTC)
          1. 7.3.5.4.1 Message Indicator Current Source (LEDI/NTC)
            1. 7.3.5.4.1.1 Message Indicator Example 1 (Single Pulse With Dead Time):
            2. 7.3.5.4.1.2 Message Indicator Example 2 (Multiple Pulses With Dead Time):
            3. 7.3.5.4.1.3 Updating The Message Indicator
      6. 7.3.6  Input Voltage (VIN ) Monitor
      7. 7.3.7  VIN Flash Monitor (Flash Current Rising)
      8. 7.3.8  Last Flash Register
      9. 7.3.9  LED Voltage Monitor
      10. 7.3.10 ADC Delay
      11. 7.3.11 Flags Register and Fault Indicators
        1. 7.3.11.1 Flash Timeout
        2. 7.3.11.2 Thermal Shutdown
        3. 7.3.11.3 LED Fault
        4. 7.3.11.4 TX1 and TX2 Interrupt Flags
        5. 7.3.11.5 LED Thermal Fault (NTC Flag)
        6. 7.3.11.6 Input Voltage Monitor Fault
    4. 7.4 Device Functional Modes
      1. 7.4.1  Start-Up (Enabling the Device)
      2. 7.4.2  Pass Mode
      3. 7.4.3  Flash Mode
      4. 7.4.4  Torch Mode
      5. 7.4.5  Privacy-Indicate Mode
      6. 7.4.6  GPIO1 Mode
      7. 7.4.7  TX2/INT/GPIO2
      8. 7.4.8  TX2 Mode
        1. 7.4.8.1 TX2 Shutdown
      9. 7.4.9  GPIO2 Mode
      10. 7.4.10 Interrupt Output (INT Mode)
      11. 7.4.11 NTC Mode
      12. 7.4.12 Alternate External Torch (AET Mode)
      13. 7.4.13 Automatic Conversion Mode
      14. 7.4.14 Manual Conversion Mode
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 START and STOP Conditions
        2. 7.5.1.2 I2C-Compatible Chip Address
        3. 7.5.1.3 Transferring Data
    6. 7.6 Register Maps
      1. 7.6.1  Enable Register
      2. 7.6.2  Torch Brightness Register
      3. 7.6.3  Flash Brightness Register
      4. 7.6.4  Flash Duration Register
      5. 7.6.5  Flags Register
      6. 7.6.6  Configuration Register 1
      7. 7.6.7  Configuration Register 2
      8. 7.6.8  GPIO Register
      9. 7.6.9  Last Flash Register
      10. 7.6.10 VLED Monitor Register
      11. 7.6.11 ADC Delay Register
      12. 7.6.12 Input Voltage Monitor Register
      13. 7.6.13 Privacy Register
      14. 7.6.14 Privacy PWM Period Register
      15. 7.6.15 Indicator Register
      16. 7.6.16 Indicator Blinking Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM3559 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Capacitor Selection
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Inductor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LM3559 Typical Application Circuit With Thermistor
        1. 8.2.2.1 Detailed Design Procedure
          1. 8.2.2.1.1 NTC Thermistor Selection
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档　
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 文档支持

11.2.1 相关文档　

更多信息，请参见以下文档：

11.3 接收文档更新通知

要接收文档更新通知，请访问 www.ti.com.cn 您器件对应的产品文件夹。点击右上角的提醒我 (Alert me) 注册后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档的修订历史记录。

11.4 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.