ZHCSBI0C March   2013  – October 2014 LM3279

PRODUCTION DATA.  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 修订历史记录
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 Handling Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 System Characteristics
   7. 6.7 System Characteristics Recommended Capacitance Specifications
   8. 6.8 Typical Performance Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1  Dynamically Adjustable Output Voltage
      2. 7.3.2  Seamless Mode Transition
      3. 7.3.3  Setting The Output Voltage
      4. 7.3.4  General Purpose Outputs
      5. 7.3.5  VCONON
      6. 7.3.6  RDSON Management
      7. 7.3.7  Supply Current Limit
      8. 7.3.8  Reverse Current Limit
      9. 7.3.9  VCON Overvoltage Clamp
      10. 7.3.10 Thermal Overload Protection
   4. 7.4 Device Functional Modes
      1. 7.4.1 Enable And Shutdown Mode
      2. 7.4.2 Low-Power Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 PFM Mode
   5. 7.5 Programming
      1. 7.5.1 Digital Control Serial Bus Interface
      2. 7.5.2 Supported Command Sequences
      3. 7.5.3 Device Enumeration
      4. 7.5.4 I/O
      5. 7.5.5 Control Interface Timing Parameters
   6. 7.6 Registers
      1. 7.6.1 Programmable Registers
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Typical Application Circuit: Digital Control
         1. 8.2.1.1 Design Requirements
         2. 8.2.1.2 Detailed Design Procedure
            1. 8.2.1.2.1 Output Current Capability
            2. 8.2.1.2.2 Recommended External Components
               1. 8.2.1.2.2.1 Inductor Selection
               2. 8.2.1.2.2.2 Input Capacitor Selection
            3. 8.2.1.2.3 Output Capacitor Selection
         3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Circuit: Analog Control
         1. 8.2.2.1 Design Requirements
         2. 8.2.2.2 Detailed Design Procedure
         3. 8.2.2.3 Application Curves
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 PCB
          1. 10.1.1.1 Energy Efficiency
          2. 10.1.1.2 EMI
    2. 10.2 Layout Examples
       1. 10.2.1 LM3279 RF Evaluation Board
       2. 10.2.2 Component Placement
    3. 10.3 DSBGA Package Assembly And Use
    4. 10.4 Manufacturing Considerations
11. 11器件和文档支持
    1. 11.1 器件支持
       1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
       1. 11.2.1 相关文档　
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
12. 12机械、封装和可订购信息