ZHCSTG3H September   1999  – March 2024 LM1084

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Ripple Rejection
      2. 6.3.2 Load Regulation
      3. 6.3.3 Overload Recovery
    4. 6.4 Device Functional Modes
      1. 6.4.1 Output Voltage
      2. 6.4.2 Stability Consideration
      3. 6.4.3 Protection Diodes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1  1.2-V to 15-V Adjustable Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2  Adjustable at 5 V
      3. 7.2.3  5-V Regulator With Shutdown
      4. 7.2.4  Battery Charger
      5. 7.2.5  Adjustable Fixed Regulator
      6. 7.2.6  Regulator with Reference
      7. 7.2.7  High Current Lamp Driver Protection
      8. 7.2.8  Battery Backup Regulated Supply
      9. 7.2.9  Ripple Rejection Enhancement
      10. 7.2.10 Automatic Light Control
      11. 7.2.11 Generating Negative Supply Voltage
      12. 7.2.12 Remote Sensing
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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7.4.1 Layout Guidelines

For the best overall performance, some layout guidelines should be followed. Place all circuit components on the same side of the circuit board and as near as practical to the respective linear regulator pins. Traces should be kept short and wide to reduce the amount of parasitic elements into the system. The actual width and thickness of traces will depend on the current carrying capability and heat dissipation required by the end system. An array of plated vias can be placed on the pad area underneath the TAB to conduct heat to any inner plane areas or to a bottom-side copper plane.