ZHCSK36 August   2019 DS160PR410

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 High Speed Electrical Characteristics
    7. 6.7 SMBUS/I2C Timing Charateristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Linear Equalization
      2. 7.3.2 DC Gain
      3. 7.3.3 Receiver Detect State Machine
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active PCIe Mode
      2. 7.4.2 Active Buffer Mode
      3. 7.4.3 Standby Mode
    5. 7.5 Programming
      1. 7.5.1 Control and Configuration Interface
        1. 7.5.1.1 Pin Mode
          1. 7.5.1.1.1 Four-Level Control Inputs
        2. 7.5.1.2 SMBUS/I2C Register Control Interface
        3. 7.5.1.3 SMBus/I2C Master Mode Configuration (EEPROM Self Load)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 PCIE x4 Lane Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DisplayPort Application
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

RNQ Package
40-Pin WQFN
Top View

Pin Functions

PIN I/O, TYPE DESCRIPTION
NAME NO.
ALL_DONE_N 8 O, 3.3-V open drain Indicates the completion of a valid EEPROM register load operation when in SMBus/I2C Master Mode (EN_SMB = L1):
High: External EEPROM load failed or incomplete
Low: External EEPROM load successful and complete
When in SMBus/I2C slave mode (EN_SMB = L3), this output will be High-Z until READ_EN_N is driven low, at which point ALL_DONE_N will be driven low.
External pullup required for operation. TI recommends a 4.7k value.
EN_SMB 2 I, 4-level Four-level control input used to select SMBus / I2C or Pin control.
The four defined levels are:
L0: Pin mode
L1: I2C or SMBus Master Mode
L2: RESERVED
L3: I2C or SMBus Slave Mode
EQ0_ADDR0 7 I, 4-level The 4-Level Control Input pins of DS160PR410 is defined according to Table 3.
If EN_SMB = L1 or L3, the pins are used to set the I2C or SMBus address of the device. The pin state is read on power up and decoded according to Table 4.
If EN_SMB = L0, the pins are decoded at power up to control the CTLE boost setting according to Table 1.
EQ1_ADDR1 6 I, 4-level
GAIN 5 I, 4-level Sets DC gain of CTLE at power up.
L0: Reserved
L1: Reserved
L2: 0 dB
L3: 3.5 dB
GND EP P EP is the Exposed Pad at the bottom of the WQFN package. It is used as the GND return for the device. The EP should be connected to ground plane(s) through low resistance path. A via array provides a low impedance path to GND, and also improves thermal dissipation.
NC 1, 14, 15, 27, 28 — No connect
PWDN1 21 I, 3.3-V LVCMOS Two-level logic controlling the operating state of the redriver.
High: Power down for channels 0 and 1
Low: Power up, normal operation for channels 0 and 1.
PWDN2 25 I, 3.3-V LVCMOS Two-level logic controlling the operating state of the redriver.
High: Power down for channels 2 and 3
Low: Power up, normal operation for channels 2 and 3.
READ_EN_N 22 I, 3.3-V LVCMOS SMBus / I2C Master Mode (with EN_SMB = L1): When asserted low, initiates the SMBus / I2C master mode EEPROM read function. When the EEPROM read is complete (indicated by assertion of ALL_DONE_N low), this pin can be held low for normal device operation.
SMBus / I2C Slave Mode (with EN_SMB = L3): When asserted low, this causes the device to be held in reset (I2C state machine reset and register reset). This pin should be pulled high to 3.3 V with a external 4.7-kΩ pullup for normal operation in SMBus / I2C Slave Mode or in pin control mode.
RSVD 24 — Reserved use for TI. The pin must be left floating (NC).
RX_DET 26 I, 4-level The RX_DET pin controls the receiver detect function. Depending on the input level, a 50-Ω or >50-kΩ termination to the power rail is enabled. See Table 2 for details.
RX0N 30 I Inverting differential inputs to the equalizer. An on-chip, 100-Ω termination resistor connects RXP to RXN. Channel 0.
RX0P 29 I Noninverting differential inputs to the equalizer. An on-chip, 100-Ω termination resistor connects RXP to RXN. Channel 0.
RX1N 33 I Inverting differential inputs to the equalizer. An on-chip, 100-Ω termination resistor connects RXP to RXN. Channel 1.
RX1P 32 I Noninverting differential inputs to the equalizer. An on-chip, 100-Ω termination resistor connects RXP to RXN. Channel 1.
RX2N 37 I Inverting differential inputs to the equalizer. An on-chip, 100-Ω termination resistor connects RXP to RXN. Channel 2.
RX2P 36 I Noninverting differential inputs to the equalizer. An on-chip, 100-Ω termination resistor connects RXP to RXN. Channel 2.
RX3N 40 I Inverting differential inputs to the equalizer. An on-chip, 100-Ω termination resistor connects RXP to RXN. Channel 3.
RX3P 39 I Noninverting differential inputs to the equalizer. An on-chip, 100-Ω termination resistor connects RXP to RXN. Channel 3.
SCL 3 I/O, 3.3-V LVCMOS, open drain SMBus / I2C clock input / open-drain output. External 1-kΩ to 5-kΩ pullup resistor is required as per SMBus / I2C interface standard. This pin is 3.3-V tolerant.
SDA 4 I/O, 3.3-V LVCMOS, open drain SMBus / I2C data input / open-drain clock output. External 1-kΩ to 5-kΩ pullup resistor is required as per SMBus interface standard. This pin is 3.3-V tolerant.
TX0N 19 O Inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. Also used for RX detection at power up. Channel 0.
TX0P 20 O Noninverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. Also used for RX detection at power up. Channel 0.
TX1N 16 O Inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. Also used for RX detection at power up. Channel 1.
TX1P 17 O Noninverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. Also used for RX detection at power up. Channel 1.
TX2N 12 O Inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. Also used for RX detection at power up. Channel 2.
TX2P 13 O Noninverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. Also used for RX detection at power up. Channel 2.
TX3N 9 O Inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. Also used for RX detection at power up. Channel 3.
TX3P 10 O Noninverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. Also used for RX detection at power up. Channel 3.
VDD 31, 34, 35, 38 P Power supply pins. VDD = 3.3 V ±10%. The VDD pins on this device should be connected through a low-resistance path to the board VDD plane.
VOD 23 I, 4-level Sets TX VOD setting at power up.
L0: –6 dB
L1: –3.5 dB
L2: 0 dB
L3: –1.6 dB
VREG 11, 18 P Internal voltage regulator output. Must add decoupling caps of 0.1 µF near each pins. The regulator is only for internal use. Do not use to power any external components.