ZHCSC08C December   2013  – August 2015 DLPC6401

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics (Normal Mode)
    7. 6.7  System Oscillators Timing Requirements
    8. 6.8  Test and Reset Timing Requirements
    9. 6.9  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    10. 6.10 Port 1 Input Pixel Interface Timing Requirements
    11. 6.11 Port 2 Input Pixel Interface (FPD-Link Compatible LVDS Input) Timing Requirements
    12. 6.12 Synchronous Serial Port (SSP) Interface Timing Requirements
    13. 6.13 Programmable Output Clocks Switching Characteristics
    14. 6.14 Synchronous Serial Port (SSP) Interface Switching Characteristics
    15. 6.15 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Reset Operation
        1. 7.3.1.1 Power-Up Reset Operation
        2. 7.3.1.2 System Reset Operation
        3. 7.3.1.3 Spread Spectrum Clock Generator Support
        4. 7.3.1.4 GPIO Interface
        5. 7.3.1.5 Source Input Blanking
        6. 7.3.1.6 Video and Graphics Processing Delay
      2. 7.3.2 Program Memory Flash/SRAM Interface
        1. 7.3.2.1 Calibration and Debug Support
        2. 7.3.2.2 Board-Level Test Support
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 System Power Regulation
    2. 9.2 System Power-Up Sequence
    3. 9.3 Power-On Sense (POSENSE) Support
    4. 9.4 System Environment and Defaults
      1. 9.4.1 DLPC6401 System Power-Up and Reset Default Conditions
      2. 9.4.2 1.2-V System Power
      3. 9.4.3 1.8-V System Power
      4. 9.4.4 1.9-V System Power
      5. 9.4.5 3.3-V System Power
      6. 9.4.6 FPD-Link Input LVDS System Power
      7. 9.4.7 Power Good (PWRGOOD) Support
      8. 9.4.8 5-V Tolerant Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Guidelines for Internal ASIC Power
      2. 10.1.2 PCB Layout Guidelines for Quality Auto-Lock Performance
      3. 10.1.3 DMD Interface Considerations
      4. 10.1.4 General Handling Guidelines for Unused CMOS-Type Pins
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
        1. 11.1.1.1 视频时序参数定义
        2. 11.1.1.2 器件标记
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (June 2015) to C Revision

  • 已更新器件标记图。Go

Changes from A Revision (January 2014) to B Revision

  • 已添加 ESD 额定值表,特性 描述部分,器件功能模式应用和实施部分,电源相关建议部分,布局部分,器件和文档支持部分以及机械、封装和可订购信息部分 Go
  • Removed V(ESD) values from Electrical Characteristics table Go

Changes from * Revision (December 2013) to A Revision

  • 已删除产品预览条Go