ZHCSCC0A April   2014  – July 2015 CSD95372BQ5MC

PRODUCTION DATA.  

  1. 1特性
  2. 2应用
  3. 3说明
    1.     Device Images
  4. 4修订历史记录
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
  7. 7Application Schematic
  8. 8器件和文档支持
    1. 8.1 社区资源
    2. 8.2 商标
    3. 8.3 静电放电警告
    4. 8.4 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 机械制图
    2. 9.2 建议印刷电路板 (PCB) 焊盘图案
    3. 9.3 建议模板开口

封装选项

机械数据 (封装 | 引脚)
  • DMC|12
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1 Absolute Maximum Ratings

TA = 25°C (unless otherwise noted)(1)
MIN MAX UNIT
VIN to PGND –0.3 25 V
VIN to VSW –0.3 25 V
VIN to VSW (10 ns) –7 27 V
VSW to PGND –0.3 20 V
VSW to PGND (10 ns) –7 23 V
VDD to PGND –0.3 7 V
ENABLE, PWM, FCCM. TAO, IOUT, REFIN to PGND –0.3 VDD + 0.3 V V
BOOT to BOOT_R(2) –0.3 VDD + 0.3 V V
PD Power dissipation 12 W
TJ Operating junction –55 150 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed underAbsolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Should not exceed 7 V.