6.4 Thermal Information
TA = 25°C (unless otherwise noted)
| THERMAL METRIC |
MIN |
TYP |
MAX |
UNIT |
| RθJC(top)
|
Junction-to-case (top of package) thermal resistance(1)
|
|
|
5 |
°C/W |
| RθJB
|
Junction-to-board thermal resistance(2)
|
|
|
1.5 |
°C/W |
(1) RθJC(top) is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in x 1.5-in, 0.06-in (1.52-mm) thick FR4 board.
(2) RθJB value based on hottest board temperature within 1 mm of the package.