ZHCSAE6B September   2012  – January 2016 CSD17551Q3A

PRODUCTION DATA.  

  1. 1特性
  2. 2应用
  3. 3说明
    1.     顶视图
      1.      Device Images
  4. 4修订历史记录
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6器件和文档支持
    1. 6.1 社区资源
    2. 6.2 商标
    3. 6.3 静电放电警告
    4. 6.4 Glossary
  7. 7机械、封装和可订购信息
    1. 7.1 Q3A 封装尺寸
    2. 7.2 Q3A 建议的 PCB 布局
    3. 7.3 Q3A 建议的模板布局
    4. 7.4 Q3A 卷带信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DNH|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJC Junction-to-case thermal resistance(1) 3.9 °C/W
RθJA Junction-to-ambient thermal resistance (1)(2) 60 °C/W
(1) RθJC is determined with the device mounted on a 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inches × 1.5 inches
(3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu.

CSD17551Q3A m0161-01_lps202.gif
Max RθJA = 60°C/W when mounted on 1 inch2 (6.45 cm2) of
2 oz. (0.071 mm thick) Cu.
CSD17551Q3A m0161-02_lps202.gif
Max RθJA = 144°C/W when mounted on a minimum pad area of 2 oz. (0.071 mm thick) Cu.