ZHCSAB6E October   2012  – May 2018

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Supply Current
    6. 7.6  Electrical Characteristics: Digital Input and Output DC
    7. 7.7  Electrical Characteristics: Power-On Reset
    8. 7.8  Electrical Characteristics: 2.5-V LDO Regulator
    9. 7.9  Electrical Characteristics: Internal Clock Oscillators
    10. 7.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 7.11 Electrical Characteristics: ADC (Temperature and Cell Voltage)
    12. 7.12 Electrical Characteristics: Data Flash Memory
    13. 7.13 HDQ Communication Timing Characteristics
    14. 7.14 I2C-Compatible Interface Timing Characteristics
    15. 7.15 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fuel Gauging
      2. 8.3.2 Impedance Track Variables
        1. 8.3.2.1  Load Mode
        2. 8.3.2.2  Load Select
        3. 8.3.2.3  Reserve Cap-mAh
        4. 8.3.2.4  Reserve Energy
        5. 8.3.2.5  Design Energy Scale
        6. 8.3.2.6  Dsg Current Threshold
        7. 8.3.2.7  Chg Current Threshold
        8. 8.3.2.8  Quit Current, Dsg Relax Time, Chg Relax Time, and Quit Relax Time
        9. 8.3.2.9  Qmax
        10. 8.3.2.10 Update Status
        11. 8.3.2.11 Avg I Last Run
        12. 8.3.2.12 Avg P Last Run
        13. 8.3.2.13 Delta Voltage
        14. 8.3.2.14 Ra Tables and Ra Filtering Related Parameters
        15. 8.3.2.15 MaxScaleBackGrid
        16. 8.3.2.16 Max DeltaV, Min DeltaV
        17. 8.3.2.17 Qmax Max Delta %
        18. 8.3.2.18 Fast Resistance Scaling
        19. 8.3.2.19 StateOfCharge() Smoothing
        20. 8.3.2.20 DeltaV Max Delta
        21. 8.3.2.21 Lifetime Data Logging Parameters
    4. 8.4 Device Functional Modes
      1. 8.4.1  System Control Function
        1. 8.4.1.1 SHUTDOWN Mode
        2. 8.4.1.2 INTERRUPT Mode
        3. 8.4.1.3 Battery Level Indication
        4. 8.4.1.4 Internal Short Detection
        5. 8.4.1.5 Tab Disconnection Detection
      2. 8.4.2  Temperature Measurement and the TS Input
      3. 8.4.3  Over-Temperature Indication
        1. 8.4.3.1 Over-Temperature: Charge
        2. 8.4.3.2 Over-Temperature: Discharge
      4. 8.4.4  Charging and Charge Termination Indication
        1. 8.4.4.1 Detection Charge Termination
        2. 8.4.4.2 Charge Inhibit
      5. 8.4.5  Power Modes
        1. 8.4.5.1 NORMAL Mode
        2. 8.4.5.2 SLEEP Mode
        3. 8.4.5.3 FULLSLEEP Mode
        4. 8.4.5.4 HIBERNATE Mode
      6. 8.4.6  Power Control
        1. 8.4.6.1 Reset Functions
        2. 8.4.6.2 Wake-Up Comparator
        3. 8.4.6.3 Flash Updates
      7. 8.4.7  Autocalibration
      8. 8.4.8  Communications
        1. 8.4.8.1 Authentication
        2. 8.4.8.2 Key Programming (Data Flash Key)
        3. 8.4.8.3 Key Programming (Secure Memory Key)
        4. 8.4.8.4 Executing An Authentication Query
      9. 8.4.9  HDQ Single-Pin Serial Interface
      10. 8.4.10 HDQ Host Interruption Feature
        1. 8.4.10.1 Low Battery Capacity
        2. 8.4.10.2 Temperature
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 I2C Time-Out
        2. 8.5.1.2 I2C Command Waiting Time
        3. 8.5.1.3 I2C Clock Stretching
      2. 8.5.2 Data Commands
        1. 8.5.2.1 Standard Data Commands
          1. 8.5.2.1.1  Control(): 0x00 and 0x01
            1. 8.5.2.1.1.1  CONTROL_STATUS: 0x0000
            2. 8.5.2.1.1.2  DEVICE_TYPE: 0x0001
            3. 8.5.2.1.1.3  FW_VERSION: 0x0002
            4. 8.5.2.1.1.4  HW_VERSION: 0x0003
            5. 8.5.2.1.1.5  RESET_DATA: 0x0005
            6. 8.5.2.1.1.6  PREV_MACWRITE: 0x0007
            7. 8.5.2.1.1.7  CHEM_ID: 0x0008
            8. 8.5.2.1.1.8  BOARD_OFFSET: 0x0009
            9. 8.5.2.1.1.9  CC_OFFSET: 0x000a
            10. 8.5.2.1.1.10 CC_OFFSET_SAVE: 0x000b
            11. 8.5.2.1.1.11 DF_VERSION: 0x000c
            12. 8.5.2.1.1.12 SET_FULLSLEEP: 0x0010
            13. 8.5.2.1.1.13 SET_HIBERNATE: 0x0011
            14. 8.5.2.1.1.14 CLEAR_HIBERNATE: 0x0012
            15. 8.5.2.1.1.15 SET_SHUTDOWN: 0x0013
            16. 8.5.2.1.1.16 CLEAR_SHUTDOWN: 0x0014
            17. 8.5.2.1.1.17 SET_HDQINTEN: 0x0015
            18. 8.5.2.1.1.18 CLEAR_HDQINTEN: 0x0016
            19. 8.5.2.1.1.19 STATIC_CHEM_DF_CHKSUM: 0x0017
            20. 8.5.2.1.1.20 SEALED: 0x0020
            21. 8.5.2.1.1.21 IT ENABLE: 0x0021
            22. 8.5.2.1.1.22 RESET: 0x0041
            23. 8.5.2.1.1.23 EXIT_CAL: 0x0080
            24. 8.5.2.1.1.24 Enter_cal: 0x0081
            25. 8.5.2.1.1.25 OFFSET_CAL: 0x0082
          2. 8.5.2.1.2  AtRate(): 0x02 and 0x03
          3. 8.5.2.1.3  UnfilteredSOC(): 0x04 And 0x05
          4. 8.5.2.1.4  Temperature(): 0x06 And 0x07
          5. 8.5.2.1.5  Voltage(): 0x08 And 0x09
          6. 8.5.2.1.6  Flags(): 0x0a And 0x0b
          7. 8.5.2.1.7  NominalAvailableCapacity(): 0x0c and 0x0d
          8. 8.5.2.1.8  FullAvailableCapacity(): 0x0e and 0x0f
          9. 8.5.2.1.9  RemainingCapacity(): 0x10 and 0x11
          10. 8.5.2.1.10 FullChargeCapacity(): 0x12 and 0x13
          11. 8.5.2.1.11 AverageCurrent(): 0x14 and 0x15
          12. 8.5.2.1.12 TimeToEmpty(): 0x16 And 0x17
          13. 8.5.2.1.13 FilteredFCC(): 0x18 And 0x19
          14. 8.5.2.1.14 StandbyCurrent(): 0x1a And 0x1b
          15. 8.5.2.1.15 UnfilteredFCC(): 0x1c And 0x1d
          16. 8.5.2.1.16 MaxLoadCurrent(): 0x1e And 0x1f
          17. 8.5.2.1.17 UnfilteredRM(): 0x20 And 0x21
          18. 8.5.2.1.18 FilteredRM(): 0x22 And 0x23
          19. 8.5.2.1.19 AveragePower(): 0x24 And 0x25
          20. 8.5.2.1.20 InternalTemperature(): 0x28 And 0x29
          21. 8.5.2.1.21 CycleCount(): 0x2a And 0x2b
          22. 8.5.2.1.22 StateOfCharge(): 0x2c And 0x2d
          23. 8.5.2.1.23 StateOfHealth(): 0x2e And 0x2f
          24. 8.5.2.1.24 PassedCharge(): 0x34 And 0x35
          25. 8.5.2.1.25 Dod0(): 0x36 And 0x37
          26. 8.5.2.1.26 SelfDischargeCurrent(): 0x38 And 0x39
      3. 8.5.3 Extended Data Commands
        1. 8.5.3.1  PackConfig(): 0x3a and 0x3b
        2. 8.5.3.2  DesignCapacity(): 0x3c And 0x3d
        3. 8.5.3.3  DataFlashClass(): 0x3e
        4. 8.5.3.4  DataFlashBlock(): 0x3f
        5. 8.5.3.5  BlockData(): 0x40 Through 0x5f
        6. 8.5.3.6  BlockDataChecksum(): 0x60
        7. 8.5.3.7  BlockDataControl(): 0x61
        8. 8.5.3.8  DeviceNameLength(): 0x62
        9. 8.5.3.9  DeviceName(): 0x63 Through 0x6c
        10. 8.5.3.10 Reserved: 0x6a Through 0x7f
      4. 8.5.4 Data Flash Interface
        1. 8.5.4.1 Accessing the Data Flash
        2. 8.5.4.2 Manufacturer Information Blocks
      5. 8.5.5 Access Modes
      6. 8.5.6 Sealing and Unsealing Data Flash
      7. 8.5.7 Data Flash Summary
    6. 8.6 Register Maps
      1. 8.6.1 Pack Configuration Register
        1. Table 1. Pack Configuration Bit Definition
      2. 8.6.2 Pack Configuration B Register
        1. Table 2. Pack Configuration B Bit Definition
      3. 8.6.3 Pack Configuration C Register
        1. Table 3. Pack Configuration C Bit Definition
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 BAT Voltage Sense Input
        2. 9.2.2.2 SRP and SRN Current Sense Inputs
        3. 9.2.2.3 Sense Resistor Selection
        4. 9.2.2.4 TS Temperature Sense Input
        5. 9.2.2.5 Thermistor Selection
        6. 9.2.2.6 REGIN Power Supply Input Filtering
        7. 9.2.2.7 VCC LDO Output Filtering
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Sense Resistor Connections
      2. 11.1.2 Thermistor Connections
      3. 11.1.3 High-Current and Low-Current Path Separation
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Overview

The bq27545-G1 accurately predicts the battery capacity and other operational characteristics of a single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-of-charge (SOC) and time-to-empty (TTE).

Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command(), are used to read and write information in the bq27545-G1 control and status registers, as well as its data flash locations. Commands are sent from the system to the gauge using the bq27545-G1 serial communications engine, and can be executed during application development, pack manufacture, or end-equipment operation.

Cell information is stored in the bq27545-G1 in non-volatile flash memory. Many of these data flash locations are accessible during application development. They cannot, generally, be accessed directly during end-equipment operation. To access to these locations, use the bq27546-G1 companion evaluation software, individual commands, or a sequence of data-flash-access commands. To access a desired data flash location, the correct data flash Subclass and offset must be known.

The bq27545-G1 provides 64 bytes of user-programmable data flash memory, partitioned into two (2) 32-byte blocks: Manufacturer Info Block A and Manufacturer Info Block B. This data space is accessed through a data flash interface. For specific details on accessing the data flash, see Manufacturer Information Blocks. The key to the bq27545-G1 high-accuracy gas gauging prediction is Texas Instrument’s proprietary Impedance Track algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge predictions that can achieve less than 1% error across a wide variety of operating conditions and over the lifetime of the battery.

The bq27545-G1 measures charge/discharge activity by monitoring the voltage across a small-value series sense resistor (5 mΩ to 20 mΩ typical) located between the CELL– and the battery’s PACK– terminal. When a cell is attached to the bq27545-G1, cell impedance is learned based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions.

The bq27545-G1 external temperature sensing is optimized with the use of a high accuracy negative temperature coefficient (NTC) thermistor with R25 = 10 kΩ ± 1% and B25/85 = 3435 K ± 1% (such as Semitec 103AT) for measurement. The bq27545-G1 can also be configured to use its internal temperature sensor. The bq27545-G1 uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality.

To minimize power consumption, the bq27545-G1 has different power modes: NORMAL, SLEEP, FULLSLEEP, and HIBERNATE. The bq27545-G1 passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. Power Modes has more details.

NOTE


FORMATTING CONVENTIONS IN THIS DOCUMENT:
    Commands: italics with parentheses() and no breaking spaces. e.g., RemainingCapacity()
    Data Flash: italics, bold, and breaking spaces. e.g., Design Capacity
    Register bits and flags: italics with brackets[ ]. e.g., [TDA]
    Data flash bits: italics, bold, and brackets[ ]. e.g.,[LED1]
    Modes and states: ALL CAPITALS. e.g., UNSEALED mode