ZHCSQZ8A May   2022  – December 2022 ADS1285

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: 1.65 V ≤ IOVDD ≤ 1.95 V and 2.7 V ≤ IOVDD ≤ 3.6 V
    7. 6.7 Switching Characteristics: 1.65V ≤ IOVDD ≤ 1.95V and 2.7 V ≤ IOVDD ≤ 3.6 V
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 PGA and Buffer
        1. 8.3.2.1 Programmable Gain Amplifier (PGA)
        2. 8.3.2.2 Buffer Operation (PGA Bypass)
      3. 8.3.3 Voltage Reference Input
      4. 8.3.4 IOVDD Power Supply
      5. 8.3.5 Modulator
        1. 8.3.5.1 Modulator Overdrive
      6. 8.3.6 Digital Filter
        1. 8.3.6.1 Sinc Filter Section
        2. 8.3.6.2 FIR Filter Section
        3. 8.3.6.3 Group Delay and Step Response
          1. 8.3.6.3.1 Linear Phase Response
          2. 8.3.6.3.2 Minimum Phase Response
        4. 8.3.6.4 HPF Stage
      7. 8.3.7 Clock Input
      8. 8.3.8 GPIO
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
      2. 8.4.2 Power-Down Mode
      3. 8.4.3 Reset
      4. 8.4.4 Synchronization
        1. 8.4.4.1 Pulse-Sync Mode
        2. 8.4.4.2 Continuous-Sync Mode
      5. 8.4.5 Sample Rate Converter
      6. 8.4.6 Offset and Gain Calibration
        1. 8.4.6.1 OFFSET Register
        2. 8.4.6.2 GAIN Register
        3. 8.4.6.3 Calibration Procedure
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Input (DIN)
        4. 8.5.1.4 Data Output (DOUT)
        5. 8.5.1.5 Data Ready (DRDY)
      2. 8.5.2 Conversion Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1  Single Byte Command
        2. 8.5.3.2  WAKEUP: Wake Command
        3. 8.5.3.3  STANDBY: Software Power-Down Command
        4. 8.5.3.4  SYNC: Synchronize Command
        5. 8.5.3.5  RESET: Reset Command
        6. 8.5.3.6  Read Data Direct
        7. 8.5.3.7  RDATA: Read Conversion Data Command
        8. 8.5.3.8  RREG: Read Register Command
        9. 8.5.3.9  WREG: Write Register Command
        10. 8.5.3.10 OFSCAL: Offset Calibration Command
        11. 8.5.3.11 GANCAL: Gain Calibration Command
    6. 8.6 Register Map
      1. 8.6.1 Register Descriptions
        1. 8.6.1.1 ID/SYNC: Device ID, SYNC Register (Address = 00h) [Reset = xxxx0000b]
        2. 8.6.1.2 CONFIG0: Configuration Register 0 (Address = 01h) [Reset = 12h]
        3. 8.6.1.3 CONFIG1: Configuration Register 1 (Address = 02h) [Reset = 00h]
        4. 8.6.1.4 HPF0, HPF1: High-Pass Filter Registers (Address = 03h, 04h) [Reset = 32h, 03h]
        5. 8.6.1.5 OFFSET0, OFFSET1, OFFSET2: Offset Calibration Registers (Address = 05h, 06h, 07h) [Reset = 00h, 00h, 00h]
        6. 8.6.1.6 GAIN0, GAIN1, GAIN2: Gain Calibration Registers (Address = 08h, 09h, 0Ah) [Reset = 00h, 00h, 40h]
        7. 8.6.1.7 GPIO: Digital Input/Output Register (Address = 0Bh) [Reset = 000xx000b]
        8. 8.6.1.8 SRC0, SRC1: Sample Rate Converter Registers (Address = 0Ch, 0Dh) [Reset = 00h, 80h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Analog Power Supplies
      2. 9.3.2 Digital Power Supply
      3. 9.3.3 Grounds
      4. 9.3.4 Thermal Pad
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RHB|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

ADS1285 是一款 32 位低功耗模数转换器 (ADC)，具有一个可编程增益放大器 (PGA) 和一个有限脉冲响应 (FIR) 滤波器。该 ADC 可满足地震监测设备的低噪声精密数字化和更长电池运行时间的严苛要求。

低噪声 PGA 允许直接连接地震检波器和变压器耦合水听器，无需外部放大器。

该 ADC 包含一个高分辨率 Δ-Σ 调制器和一个具有可编程相位响应的 FIR 滤波器。高通滤波器可从信号中移除直流和低频成分。时钟频率误差由分辨率为 7ppb 的采样率转换器进行补偿。

通过选择功率模式可优化动态范围和功耗。PGA 旁路运行可进一步降低功耗。

该 ADC 采用紧凑的 5mm × 5mm VQFN 封装，额定工作状态下的环境温度范围为 –40°C 至 +85°C。

封装信息(1)
器件型号 封装 封装尺寸（标称值）
ADS1285 RHB（VQFN，32） 5.00mm × 5.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的封装选项附录。
功能方框图