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OCTVO-3P-OSD62X
Octavo Systems OSD62x system-in-package for AM623 and AM625 Arm® Cortex®-A53 1.4-GHz processors
OCTVO-3P-OSD62X
概覽
The OSD62x SiP technology allows designers to build a smaller generation of a variety of products in the same applications where the AM62x device is commonly used, including: building automation, factory automation and control, IoT gateway, edgeAI, and HMI. The SiP integrates the low-power, high-performance MPU with other bare die to provide features that will differentiate these products and help bring them to market faster, instead of spending time getting the processor to function.
特點
- 2 mm x 22 mm (-MI), 9 mm x 14 mm (-SO)
- BGA package with 1-mm pitch (-MI), 0.5-mm pitch (-SO)
- Up to 2GB DDR4 integrated, external eMMC and QSPI Flash
- Passive components integrated in SiP (-MI and -SO versions)
- PMIC, 4kB EEPROM, oscillators, and MCU co-processor integrated (-MI version only)
訂購並開始開發
開發板
OSD62X-MI — OSD62x maximum integration SiP for AM62x processors in 22 mm x 22 mm BGA package
OSD62X-MI — OSD62x maximum integration SiP for AM62x processors in 22 mm x 22 mm BGA package
開發板
OSD62X-SO — OSD62x size optimized SiP for AM62x processors in 9 mm x 14 mm BGA package
OSD62X-SO — OSD62x size optimized SiP for AM62x processors in 9 mm x 14 mm BGA package
支援與培訓
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