BOOSTXL-CC2650MA
TI SimpleLink™ Bluetooth® 저에너지 CC2650 모듈 BoosterPack™ 플러그인 모듈
BOOSTXL-CC2650MA
개요
SimpleLink™ Bluetooth® 저에너지 CC2650 모듈 BoosterPack 플러그인 모듈은 Launchpad™ 개발 키트에 Bluetooth 저에너지를 추가하는 빠르고 간편한 방법을 제공합니다. CC2650 모듈 BoosterPack 키트를 MSP432™ 마이크로컨트롤러(MCU)LaunchPad 키트에 연결하기만 하면 시작할 수 있습니다! 개발을 시작하기 위한 소프트웨어 예시는 여기에서 확인할 수 있습니다.
CC2650 모듈 BoosterPack 키트는 간단한 UART 인터페이스를 사용하여 모든 애플리케이션에 Bluetooth 저에너지 연결을 추가할 수 있는 무선 네트워크 프로세서 소프트웨어로 프로그래밍되어 있습니다. 모듈 BoosterPack 키트에는 CC2650 모듈을 프로그래밍하고 디버깅하기 위한 JTAG 연결도 포함되어 있습니다. 따라서 CC2650 모듈에서 모든 Bluetooth 저에너지 애플리케이션을 개발할 수 있습니다.
참고: 소프트웨어 예시 및 CC2650 모듈 BoosterPack을 사용하려면 MSP432 LaunchPad 키트도 필요합니다. 두 개의 EVM으로 구성된 번들이 제공됩니다.
특징
- 통합 안테나가 포함된 CC2650 모듈을 사용하는 Bluetooth 저에너지 모듈 BoosterPack 키트
- 애플리케이션 프로세서인 MSP432 MCU용 소프트웨어 예시가 포함됨
- FCC/IC, CE 및 ARIB 무선 표준 사전 인증 획득
- 모듈에서 Bluetooth 저에너지 애플리케이션 개발을 위한 디버그 인터페이스
- Bluetooth 4.2 사양 인증 획득
- CC2650 모듈 BoosterPack 1개
- 10핀 JTAG 디버그 케이블
- 추가 CC2650 모듈 샘플 1개
- MSP432 LaunchPad에서 실행되는 호스트 코드 예시를 다운로드하려면 이 페이지를 방문하세요.
저전력 2.4GHz 제품
주문 및 개발 시작
BOOSTXL-CC2650MA — TI SimpleLink™ Bluetooth® 저에너지 CC2650 모듈 BoosterPack™ 플러그인 모듈
BOOSTXL-CC2650MA — TI SimpleLink™ Bluetooth® 저에너지 CC2650 모듈 BoosterPack™ 플러그인 모듈
BLE-STACK-2-X — BLE-STACK - V2.2 (Support for CC2640/CC2650)
지원되는 제품 및 하드웨어
제품
저전력 2.4GHz 제품
하드웨어 개발
개발 키트
평가 보드
BLE-STACK-2-X — BLE-STACK - V2.2 (Support for CC2640/CC2650)
제품
저전력 2.4GHz 제품
하드웨어 개발
개발 키트
평가 보드
문서
Archive Installers for Simplelink BLE 2 x SDK
출시 정보
This is version 2.2.8 of the TI Bluetooth® low energy protocol stack Software Development Kit (SDK). The BLE-Stack SDK allows for the development of single-mode Bluetooth low energy (BLE) applications on TI's first generation SimpleLink Bluetooth low energy CC2640 and Multi-Standard CC2650 wireless microcontroller units (MCUs) supporting version 5.1 of the Bluetooth specification with features defined by version 4.2 of the Bluetooth specification. The CC26x0 family of wireless MCUs includes a 32-bit Arm® Cortex™-M3 as the main application CPU running at 48 MHz, a dedicated Cortex-M0 processor for the radio / Physical Layer (PHY), and an autonomous Sensor Controller Engine for low-power sensing applications. The BLE protocol stack is built on top of the TI Real-time Operating System (TI-RTOS) which provides advanced power management and flexible peripheral driver capabilities allowing the development of highly optimized and power efficient standalone or network processor applications. The TI-RTOS SDK is installed during the BLE-Stack SDK installation.
Version 2.2.8 of the BLE-Stack is a maintenance update to TI's existing royalty-free Bluetooth low energy software protocol stack which is certified for Bluetooth specification version 5.1. This release includes support for all core specification version 4.2 Low Energy (LE) features as well as several development kits. This protocol stack update is in addition to support of all major Bluetooth LE core specification version 4.1 features, including support for up to 8 master or slave BLE connections. Please note that no Bluetooth 5 or Bluetooth 5.1 features are supported. A few examples of what can be created using the sample applications in this SDK and/or the additional resources found in the Examples section below include Bluetooth beacons incorporating the popular Apple iBeacon® and Eddystone™ formats, glucose, heart rate and fitness monitors, dongles for cable replacement via a BLE Serial Port Bridge and industrial motor monitors.
See What's New section for an overview of the changes included in this release. The Bluetooth core specification version 4.2 features supported in this release allow development of the most secure and power efficient products incorporating the Bluetooth low energy specification.
새 소식
- [PSIRT-129] The generate key functions (ECCROMCC26XX_genKeys, and ECC_generateKey) shall now validate the ECC key pair
CC26XX-REPORTS — CC26xx regulatory certifcation reports
지원되는 제품 및 하드웨어
제품
저전력 2.4GHz 제품
하드웨어 개발
평가 보드
CC26XX-REPORTS — CC26xx regulatory certifcation reports
제품
저전력 2.4GHz 제품
하드웨어 개발
평가 보드
문서
Link to FCC, ISED, CE, & Japan Certification Reports
Link to FCC, ISED, CE, & UK, Japan, Korea, and Taiwan Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to CC3230x-CC26x2EM-7ID Reference-Only CE & FCC Certification Reports
출시 정보
This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.
새 소식
- Updated CC2651R3SIPAT0MOUR with Japan, Korea, and Tiawan reports
- Updated CC2652RSIPMOT CE with missing safety report
SIMPLELINK-SDK-BLUETOOTH-PLUGIN — Bluetooth Plug-in for SimpleLink™ MCU SDK
지원되는 제품 및 하드웨어
제품
Arm Cortex-M4 MCU
Wi-Fi 제품
저전력 2.4GHz 제품
하드웨어 개발
개발 키트
평가 보드
SIMPLELINK-SDK-BLUETOOTH-PLUGIN — Bluetooth Plug-in for SimpleLink™ MCU SDK
Windows Installer for SimpleLink SDK BLE Plugin
macOS Installer for SimpleLink SDK BLE Plugin
Linux Installer for SimpleLink SDK BLE Plugin
제품
Arm Cortex-M4 MCU
Wi-Fi 제품
저전력 2.4GHz 제품
하드웨어 개발
개발 키트
평가 보드
문서
SimpleLink SDK BLE Plugin User's Guide
새 소식
- This version of the SimpleLink Bluetooth Plugin now enables a BLE two-chip solution to act as a GAP Central role. Previous versions of this plugin only included support for GAP Peripheral role. This new functionality is showcased through the addition of the new simple_central example, which uses the MSP432E401Y as the Host device and the CC26x2R1 as the NWP. The simple_central example demonstrates the following features:
- Host: MSP432E401Y
- NWP: CC26X2R1
- GAP Central role support
- Host Controller Interface (HCI) protocol used for communication with the NWP
- BLE5 support
- Power management
- Low Energy Secure Connection (LESC) Pairing
- Tested with up to 4 peripherals connected simultaneously (but can support more than 4 connections)
- Supports a subset of TI Vendor Specific HCI commands and Bluetooth LE HCI commands/events. More information on these APIs can be found BLE Vendor Specific API Guide.
- Works out-of-box with the Sensors BoosterPack and Project Zero examples that are also in the SimpleLink SDK Bluetooth Plugin.
- The GAP Central source code is also showcased in a separate downloadable: the SimpleLink BLE Plugin Azure Gateway Example Pack. This example pack demonstrates enabling a user’s BLE two-chip solution to become a gateway to the Azure IoT cloud. The SimpleLink BLE Plugin Azure Gateway Example Pack can be found on www.ti.com.
출시 정보
The SimpleLink™ SDK BLE Plugin is a companion software package that enables the use of a Bluetooth radio on any standard MSP432P4 platform, MSP432E4 or CC32XX platform, and enables this two-chip solution to act as either a GAP Peripheral role or a GAP Central role. By having the ability to seamlessly and modularly add Bluetooth functionality (more specifically Bluetooth Low Energy/BLE) to an embedded system, a programmer can enable their embedded device to become a gateway to various IOT infrastructures.
For examples demonstrating the two-chip solution in a peripheral role, the plugin leverages the use of the TI Simple Application Processor (SAP) driver connected to a CC26xx Simple Network Processor (SNP) to provide a highly customizable hardware configuration. For software connectivity between the SAP and the SNP, an architecture agnostic HAL/Drivers layer is used to promote software portability and maximize collateral reuse.
For examples demonstrating the two-chip solution in a central role, communication between the NWP and the Host occurs through a UART serial interface using the Host Controller Interface (HCI) protocol. TI Vendor Specific HCI commands and a limited subset of Bluetooth LE HCI commands/events to implement a Bluetooth application. By using TI Vendor Specific commands and events, the application can communicate with and access the BLE stack.
설계 파일
기술 자료
| 유형 | 직함 | 최신 영어 버전 다운로드 | 날짜 | ||
|---|---|---|---|---|---|
| 인증서 | BOOSTXL-CC2650MA EU Declaration of Conformity (DoC) | 2019. 1. 2 | |||
| e북 | TI-RSLK modules 1 - 20 (Rev. A) | 2018. 5. 30 | |||
| 추가 자료 | Lab: Sensor Integration | 2017. 11. 17 | |||
| 추가 자료 | Jacki Project Lecture | 2017. 11. 17 | |||
| 추가 자료 | Introduction: Sensor Integration | 2017. 11. 17 | |||
| 백서 | SimpleLink™ MSP432™ MCU for electronic lock and intrusion HMI keypad | 2017. 9. 18 | |||
| 애플리케이션 노트 | Running Standalone Bluetooth® low energy Applications on CC2650 Module (Rev. A) | PDF | HTML | 2017. 6. 7 | ||
| 사용 설명서 | CC2650 Module BoosterPack™ Getting Started Guide (Rev. A) | 2016. 6. 29 |