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SIMPLELINK-SDK-BLUETOOTH-PLUGIN

SimpleLink™ MCU SDK 蓝牙插件

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最新版本
版本: 3.20.00.24
发布日期: 31 七月 2019

Windows Installer for SimpleLink SDK BLE Plugin

MD5 校验和

macOS Installer for SimpleLink SDK BLE Plugin

MD5 校验和

Linux Installer for SimpleLink SDK BLE Plugin

MD5 校验和
lock = 需要出口许可(1 分钟)
产品
Wi-Fi 产品
CC3220S 具有安全启动和 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 Wi-Fi® 无线 MCU CC3220SF 具有 1MB 闪存和 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 Wi-Fi® 无线 MCU CC3235S 具有 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 双频带 Wi-Fi® 无线 MCU CC3235SF 具有 1MB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4 双频带 Wi-Fi® 无线 MCU
Arm Cortex-M4 MCU
MSP432E401Y 具有以太网、CAN、1MB 闪存和 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4F MCU MSP432E411Y 具有以太网、CAN、TFT LCD、1MB 闪存和 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4F MCU
低功耗 2.4GHz 产品
CC2640 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 低功耗 Bluetooth® 无线 MCU CC2642R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU CC2650 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 多协议 2.4GHz 无线 MCU CC2650MODA 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 多协议 2.4GHz 无线模块 CC2652R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU
硬件开发
BOOSTXL-CC2650MA TI SimpleLink 低功耗 Bluetooth® CC2650 模块 BoosterPack 插件模块 CC3220S-LAUNCHXL CC3220S LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU CC3220SF-LAUNCHXL CC3220SF LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU LAUNCHXL-CC2640R2 CC2640R2 LaunchPad™ development kit for SimpleLink™ Bluetooth® Low Energy wireless MCU LAUNCHXL-CC26X2R1 CC26x2R SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LAUNCHXL-CC3235S CC3235S dual-band LaunchPad™ development kit for Wi-Fi® SimpleLink™ MCU LAUNCHXL-CC3235SF CC3235SF dual-band LaunchPad™ development kit for Wi-Fi® SimpleLink™ MCU MSP-EXP432E401Y MSP432E401Y LaunchPad™ development kit for Ethernet SimpleLink™ MCU

文档

SimpleLink SDK BLE Plugin User's Guide

最新动态

  • This version of the SimpleLink Bluetooth Plugin now enables a BLE two-chip solution to act as a GAP Central role. Previous versions of this plugin only included support for GAP Peripheral role. This new functionality is showcased through the addition of the new simple_central example, which uses the MSP432E401Y as the Host device and the CC26x2R1 as the NWP. The simple_central example demonstrates the following features:
    • Host: MSP432E401Y
    • NWP: CC26X2R1
    • GAP Central role support
    • Host Controller Interface (HCI) protocol used for communication with the NWP
    • BLE5 support
    • Power management
    • Low Energy Secure Connection (LESC) Pairing
    • Tested with up to 4 peripherals connected simultaneously (but can support more than 4 connections)
    • Supports a subset of TI Vendor Specific HCI commands and Bluetooth LE HCI commands/events. More information on these APIs can be found BLE Vendor Specific API Guide.
    • Works out-of-box with the Sensors BoosterPack and Project Zero examples that are also in the SimpleLink SDK Bluetooth Plugin.
    • The GAP Central source code is also showcased in a separate downloadable: the SimpleLink BLE Plugin Azure Gateway Example Pack. This example pack demonstrates enabling a user’s BLE two-chip solution to become a gateway to the Azure IoT cloud. The SimpleLink BLE Plugin Azure Gateway Example Pack can be found on www.ti.com.

发布信息

The SimpleLink™ SDK BLE Plugin is a companion software package that enables the use of a Bluetooth radio on any standard MSP432P4 platform, MSP432E4 or CC32XX platform, and enables this two-chip solution to act as either a GAP Peripheral role or a GAP Central role. By having the ability to seamlessly and modularly add Bluetooth functionality (more specifically Bluetooth Low Energy/BLE) to an embedded system, a programmer can enable their embedded device to become a gateway to various IOT infrastructures.

For examples demonstrating the two-chip solution in a peripheral role, the plugin leverages the use of the TI Simple Application Processor (SAP) driver connected to a CC26xx Simple Network Processor (SNP) to provide a highly customizable hardware configuration. For software connectivity between the SAP and the SNP, an architecture agnostic HAL/Drivers layer is used to promote software portability and maximize collateral reuse.

For examples demonstrating the two-chip solution in a central role, communication between the NWP and the Host occurs through a UART serial interface using the Host Controller Interface (HCI) protocol. TI Vendor Specific HCI commands and a limited subset of Bluetooth LE HCI commands/events to implement a Bluetooth application. By using TI Vendor Specific commands and events, the application can communicate with and access the BLE stack.