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TPS81256

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整合式電源解決方案，採用 MicroSiP™ 封裝的 3W 高效升壓轉換器模組

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TPS81256 將逐漸停產
此產品將逐漸停產。新設計應考量替代產品。
open-in-new 比較替代產品
功能相同，但引腳輸出與所比較的裝置不同
TPS61253A 現行 採用 1.2 mm x 1.3 mm WCSP 封裝的 3.8 MHz、5V/4A 升壓 Discrete solution
TPSM81033 現行 具有 MagPack™ 封裝技術與電源良好的 5.5V、2A、2.4MHz、同步升壓電源模組 Same functionality with higher power density

TPS81256

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產品規格表 立即訂購

產品詳細資料

Rating Catalog Topology Boost Iout (max) (A) 0.7 Vin (max) (V) 5.5 Vin (min) (V) 2.5 Vout (max) (V) 5 Vout (min) (V) 5 Features Enable, Load Disconnect, Synchronous rectification Operating temperature range (°C) -40 to 125 Type Module
Rating Catalog Topology Boost Iout (max) (A) 0.7 Vin (max) (V) 5.5 Vin (min) (V) 2.5 Vout (max) (V) 5 Vout (min) (V) 5 Features Enable, Load Disconnect, Synchronous rectification Operating temperature range (°C) -40 to 125 Type Module
USIP (SIP) 9 See data sheet
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43µA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43µA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.
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* Data sheet TPS81256 3-W, High Efficiency Step-Up Converter In MicroSiP Packaging datasheet (Rev. D) PDF | HTML 2018年 2月 2日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點