計算工具
LMH6553
- 900 MHz −3 dB Small Signal
Bandwidth @ AV = 1 - 670 MHz −3 dB Large Signal
Bandwidth @ AV = 1 - −79 dB THD @ 20 MHz
- −92 dB IMD3 @ fc = 20 MHz
- 10 ns Settling Time to 0.1%
- 600 ps Clamp Overdrive Recovery Time
- 40 mV Clamp Accuracy with 100% Overdrive
- −0.1 mV/°C Clamp Temperature Drift
- 4.5 to 12 Supply Voltage Operation
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The LMH6553 is a 900 MHz differential amplifier with an integrated adjustable output limiting clamp. The clamp increases system performance and provides transient over-voltage protection to following stages. The internal clamp feature of the LMH6553 reduces or eliminates the need for external discrete overload protection networks. When used to drive ADCs, the amplifier's output clamp allows low voltage ADC inputs to be protected from being overdriven and damaged by large input signals appearing at the system input. Fast overdrive recovery of 600 ps ensures the amplifier output rapidly recovers from a clamping event and quickly resumes to follow the input signal. The LMH6553 delivers exceptional bandwidth, distortion, and noise performance ideal for driving ADCs up to 14-bits. The LMH6553 could also be used for automotive, communication, medical, test and measurement, video, and LIDAR applications.
With external gain set resistors and integrated common mode feedback, the LMH6553 can be configured as either a differential input to differential output or single ended input to differential output gain block. The LMH6553 can be AC or DC coupled at the input which makes it suitable for a wide range of applications including communication systems and high speed oscilloscope front ends. The LMH6553 is available in 8-pin SO PowerPAD and 8-pin WSON packages, and is part of our LMH high speed amplifier family.
技術文件
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檢視所有 9 | 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | LMH6553 900 MHz Fully Differential Amplifier With Output Limiting Clamp datasheet (Rev. H) | 2013年 3月 18日 | |
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
| Application note | AN-1719 Noise Figure Analysis Fully Differential Amplifier (Rev. A) | 2013年 5月 1日 | ||
| User guide | LMH6553SDEVAL High Speed Differential Amplifier Evaluation Board (Rev. A) | 2013年 5月 1日 | ||
| Application note | Using High Speed Diff Amp to Drive ADCs (Rev. A) | 2013年 4月 26日 | ||
| Analog Design Journal | Converting single-ended video to differential video in single-supply systems | 2011年 9月 16日 | ||
| Application note | Adaptive Speed Control for Automotive Systems | 2007年 11月 20日 | ||
| Application note | Selecting Amplifiers, ADCs, and Clocks for High-Performance Signal Paths | 2007年 9月 13日 | ||
| Application note | A Walk Along the Signal Path (High-Speed Signal Path) | 2005年 3月 30日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
開發板
LMH6553SDEVAL — LMH6553SDEVAL 高速差分放大器評估板
The LMH6553SDEVAL evaluation board is designed to aid in the characterization of TI`s LMH6553 fully differential amplifier with output limiting clamp in an 8-pin LLP package. The LMH6553 is part of the LMH® high speed amplifier family. Use the evaluation board as a guide for high frequency (...)
使用指南: PDF
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI 是有助於評估類比電路功能的設計和模擬環境。這款全功能設計和模擬套件使用 Cadence® 的類比分析引擎。PSpice for TI 包括業界最大的模型庫之一，涵蓋我們的類比和電源產品組合，以及特定類比行為模型，且使用無需支付費用。
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前，建立完整的終端設備設計和解決方案原型，進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中，您可以搜尋 TI (...)
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前，建立完整的終端設備設計和解決方案原型，進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中，您可以搜尋 TI (...)
模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HSOIC (DDA) | 8 | Ultra Librarian |
| WSON (NGS) | 8 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點