TS5A22364
- Specified Break-Before-Make Switching
- Negative Signaling Capability: Maximum Swing from –2.75 V to 2.75 V (VCC = 2.75 V)
- Internal Shunt Switch Prevents Audible Click-and-Pop When Switching Between Two Sources
- Low ON-State Resistance (0.65 Ω Typical)
- Low Charge Injection
- Excellent ON-State Resistance Matching
- 2.3-V to 5.5-V Power Supply (VCC)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2500-V Human-Body Model
(A114-B, Class II) - 1500-V Charged-Device Model (C101)
- 200-V Machine Model (A115-A)
- 2500-V Human-Body Model
The TS5A22364 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click/pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00-mm x 3.00-mm DRC package is also available as a nonmagnetic package for medical imaging applications.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TS5A22364 0.65-Ω Dual SPDT Analog Switches With Negative Signaling Capability 数据表 (Rev. H) | PDF | HTML | 2017-6-21 | ||
| 应用手册 | 了解多路复用器应用中的 THD 和 THD + N | PDF | HTML | 英语版 | PDF | HTML | 2025-10-23 | |
| 应用简报 | 用于多路复用器和信号开关的 1.8V 逻辑 (Rev. C) | PDF | HTML | 英语版 (Rev.C) | PDF | HTML | 2022-8-18 | |
| 应用手册 | 选择正确的德州仪器 (TI) 信号开关 (Rev. E) | PDF | HTML | 英语版 (Rev.E) | PDF | HTML | 2022-8-5 | |
| 应用手册 | 多路复用器和信号开关词汇表 (Rev. B) | 英语版 (Rev.B) | PDF | HTML | 2022-3-11 |
设计与开发
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LEADED-ADAPTER1 — 表面贴装转 DIP 接头适配器,用于快速测试 TI 的 5、8、10、16 和 24 引脚引线式封装。
EVM-LEADED1 电路板可用于对 TI 的常见引线式封装进行快速测试和电路板试验。 该电路板具有足够的空间,可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。
LEADLESS-ADAPTER1 — 表面贴装转 DIP 接头适配器,用于测试 TI 的 6、8、10、12、14、16 和 20 引脚无引线封装
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| DSBGA (YZP) | 10 | Ultra Librarian |
| VSSOP (DGS) | 10 | Ultra Librarian |
| VSON (DRC) | 10 | Ultra Librarian |
订购和质量
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