TPA1517

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6W 立体声、9.5V 至 18V 电源、模拟输入 AB 类音频放大器

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数据表

document-pdfAcrobat 6-W Stereo Audio Power Amplifier 数据表 (Rev. D) (英语)

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TPA3113D2

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6W 立体声、12W 单声道、8 至 26V、模拟输入 D 类音频放大器，带 SpeakerGuard™ Enhanced EMI suppression, enables ferrite bead filters at output

TPA1517

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数据表

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产品详情

Audio input type

Analog Input

Architecture

Class-AB

Speaker channels (max)

Stereo

Control interface

Hardware

Output power (W)

6

Power stage supply (max) (V)

18

Power stage supply (min) (V)

9.5

THD + N at 1 kHz (%)

0.1

Load (min) (Ω)

4

Analog supply voltage (min) (V)

9.5

Analog supply voltage (max) (V)

18

Rating

Catalog

Operating temperature range (°C)

-40 to 85

Audio input type

Analog Input

Architecture

Class-AB

Speaker channels (max)

Stereo

Control interface

Hardware

Output power (W)

6

Power stage supply (max) (V)

18

Power stage supply (min) (V)

9.5

THD + N at 1 kHz (%)

0.1

Load (min) (Ω)

4

Analog supply voltage (min) (V)

9.5

Analog supply voltage (max) (V)

18

Rating

Catalog

Operating temperature range (°C)

-40 to 85

PDIP (NE)

20

224.0214 mm² (24.51 mm × 9.14 mm)

HSOIC (DWP)

20

133.444125 mm² (12.825 mm × 10.405 mm)

TDA1517P Compatible
High Power Outputs (6 W/Channel)
Surface Mount Availability 20-Pin Thermal SOIC PowerPAD™
Thermal Protection
Fixed Gain: 20 dB
Mute and Standby Operation
Supply Range: 9.5 V - 18 V

PowerPAD is a trademark of Texas Instruments

TDA1517P Compatible
High Power Outputs (6 W/Channel)
Surface Mount Availability 20-Pin Thermal SOIC PowerPAD™
Thermal Protection
Fixed Gain: 20 dB
Mute and Standby Operation
Supply Range: 9.5 V - 18 V

PowerPAD is a trademark of Texas Instruments

The TPA1517 is a stereo audio power amplifier that contains two identical amplifiers capable of delivering 6 W per channel of continuous average power into a 4- load at 10% THD+N or 5 W per channel at 1% THD+N. The gain of each channel is fixed at 20 dB. The amplifier features a mute/standby function for power-sensitive applications. The amplifier is available in the PowerPAD™ 20-pin surface-mount thermally-enhanced package (DWP) that reduces board space and facilitates automated assembly while maintaining exceptional thermal characteristics. It is also available in the 20-pin thermally enhanced DIP package (NE).