可提供此产品的更新版本
功能与比较器件相同但引脚有所不同。
TLV3501A-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature Range - Device HBM Classification Level 2
- Device CDM Classification Level C4B
- Device Temperature Grade 1: –40°C to
- High Speed: 4.5 ns
- Rail-To-Rail I/O
- Supply Voltage: 2.7 V to 5.5 V
- Push-Pull CMOS Output Stage
- Shutdown
- Micro Package: SOT23-6
- Low Supply Current: 3.2 mA
- Z-Suffix Offers Improved Delamination
- APPLICATIONS
- HEV/EV and Powertrain Applications
- DC-DC Converter
- Inverter
- Fuel Sensing
- Hybrid Power Control Unit
- Automatic Test Equipment
- Threshold Detector
- Zero-Crossing Detector
- Window Comparator
All other trademarks are the property of their respective owners
The TLV3501A-Q1 push-pull output comparator features a fast 4.5-ns propagation delay and operation from 2.7 V to 5.5 V. The input voltage supports a common-mode range that goes beyond the rails which makes the device an ideal choice for low-voltage applications. The rail-to-rail output directly drives either CMOS or TTL logic. The fast delay and wide common-mode range also makes TLV3501A-Q1 device ideal for EMI reduction through frequency dithering by lowering the EMI peaks. These parameters allow the device to be ideal for both DC-DC converter and inverter applications in HEV/EV and powertrain.
The SOT23-6 microsized package provides options for portable and space-restricted applications. The Z-suffix offers reduced delamination compared to the standard device.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages 数据表 (Rev. B) | PDF | HTML | 2015-10-15 | ||
| 电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | PDF | HTML | 英语版 | PDF | HTML | 2018-1-31 |
设计与开发
如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。
AMP-PDK-EVM — 放大器高性能开发套件评估模块
放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件，与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板，主板上具有多个插槽式子卡选项以满足封装需求，使工程师能够快速评估和验证器件性能。
AMP-PDK-EVM 套件支持五种常用的业界通用封装，包括：
- D（SOIC-8 和 SOIC-14）
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV（SOT23-5 和 SOT23-6）
- DCK（SC70-5 和 SC70-6）
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| SOT-23 (DBV) | 6 | Ultra Librarian |
订购和质量
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