TLV1702-Q1
- Qualified for Automotive Applications
- AEC Q100-Qualified
With the Following Results
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
- Device HBM ESD Classification Level 2 (TLV1701-Q1)
- Device HBM ESD Classification Level 1C (TLV1702-Q1,TLV1704-Q1)
- Device CDM ESD Classification Level C6
- Supply Range: 2.2 V to 36 V or ±1.1 V to ±18 V
- Low Quiescent Current: 55 µA per Comparator
- Input Common-Mode Range Includes Both Rails
- Low Propagation Delay: 560 ns
- Low Input Offset Voltage: 300 µV
- Open Collector
Outputs:
- Up to 36 V Above Negative Supply Regardless of Supply Voltage
- Industrial Temperature Range: –40°C to +125°C
- Small Packages:
- Single: SOT23-5 and SC-70-5
- Dual: VSSOP-8
- Quad: TSSOP-14
The TLV1701-Q1 (Single), TLV1702-Q1 (Dual) and TLV1704-Q1 (Quad) devices offers a wide supply range, rail-to-rail inputs, low quiescent current, and low propagation delay. All these features come in industry-standard, extremely-small packages, making these devices the best general-purpose comparators available.
The open collector output offers the advantage of allowing the output to be pulled to any voltage rail up to 36 V above the negative power supply, regardless of the TLV170x-Q1 supply voltage.
The device is a microPower comparator. Low input offset voltage, low input bias currents, low supply current, and open-collector configuration make the TLV170x-Q1 device flexible enough to handle almost any application, from simple voltage detection to driving a single relay.
The device is specified for operation across the expanded industrial temperature range of –40°C to +125°C.
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技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TLV170x-Q1 2.2-V to 36-V, microPower Comparator 数据表 (Rev. C) | PDF | HTML | 2017-10-24 | ||
| 电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | PDF | HTML | 英语版 | PDF | HTML | 2018-1-31 |
设计与开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
AMP-PDK-EVM — 放大器高性能开发套件评估模块
放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件,与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板,主板上具有多个插槽式子卡选项以满足封装需求,使工程师能够快速评估和验证器件性能。
AMP-PDK-EVM 套件支持五种常用的业界通用封装,包括:
- D(SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 和 SOT23-6)
- DCK(SC70-5 和 SC70-6)
TLV170x and TLV170x-Q1 TINA-TI Reference Design and Macromodel (Rev. A)
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| VSSOP (DGK) | 8 | Ultra Librarian |
订购和质量
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