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Operating temperature range (°C) to Rating Catalog
Operating temperature range (°C) to Rating Catalog
LQFP (PGE) 144 484 mm² (22 mm × 22 mm)
  • CPU Features
    • Fully static RISC processor core, capable of operating from 0 to 24 MHz
      with zero wait/hold states
    • Minimum 41.7 ns instruction cycle time with a 24-MHz internal clock frequency,
      based on a 12-MHz external input
    • 47 independently vectored peripheral interrupts
  • On-Chip Memory
    • 256K bytes reprogrammable Flash program memory
    • 8K bytes Flash data memory
    • 32K bytes of static RAM data memory
    • Addresses up to 12M bytes of external memory
  • Broad Range of Hardware Communications Peripherals
    • Bluetooth Lower Link Controller (LLC) including a shared 4.5K byte
      Bluetooth RAM and 1K byte Sequencer RAM
    • Universal Serial Bus (USB) 1.1 full-speed node
    • ACCESS.bus serial bus (compatible with Philips I2C bus)
    • CAN interface with 15 message buffers conforming to CAN specification
      2.0B active
    • 8/16-bit SPI, Microwire/Plus serial interface
    • Four-channel Universal Asynchronous Receiver/Transmitter (UART), one
      channel has USART capability
    • Advanced Audio Interface (AAI) to connect to external 8/ 13-bit PCM Codecs
      as well as to ISDN-Controllers through the IOM-2 interface (slave only)
    • CVSD/PCM converter supporting one bidirectional audio connection
  • General-Purpose Hardware Peripherals
    • 12-bit A/D Converter (ADC)
    • Dual 16-bit Multi-Function Timer (MFT)
    • Versatile Timer Unit with four subsystems (VTU)
    • Four-channel DMA controller
    • Timing and Watchdog Unit
    • Random Number Generator peripheral
  • Extensive Power and Clock Management Support
    • On-chip Phase Locked Loop
    • Support for multiple clock options
    • Dual clock and reset
    • Power-down modes
  • Flexible I/O
    • Up to 54 general-purpose I/O pins (shared with on-chip peripheral I/O)
    • Programmable I/O pin characteristics: TRI- STATE output, push-pull output,
      weak pull- up input, high-impedance input
    • Schmitt triggers on general-purpose inputs
    • Multi-Input Wake-Up (MIWU) capability
  • Power Supply
    • I/O port operation at 2.5V to 3.3V
    • Core logic operation at 2.5V
    • On-chip power-on reset
  • Temperature Range
    • –40°C to +85°C (Industrial)
  • Packages
    • LQFP-128, LQFP-144
  • Complete Development Environment
    • Pre-integrated hardware and software support for rapid prototyping and
      production
    • Integrated environment
    • Project manager
    • Multi-file C source editor
    • High-level C source debugger
    • Comprehensive, integrated, one-stop technical support
  • Bluetooth Protocol Stack
    • Applications can interface to the high-level protocols or directly to
      the low-level Host Controller Interface (HCI)
    • Transport layer support allows HCI command-based interface over UART port
    • Baseband (Link Controller) hardware minimizes the bandwidth demand on the CPU
    • Link Manager (LM)
    • Logical Link Control and Adaptation Protocol (L2CAP)
    • Service Discovery Protocol (SDP)
    • RFCOMM Serial Port Emulation Protocol
    • All packet types, piconet, and scatternet functionality supported

  • CPU Features
    • Fully static RISC processor core, capable of operating from 0 to 24 MHz
      with zero wait/hold states
    • Minimum 41.7 ns instruction cycle time with a 24-MHz internal clock frequency,
      based on a 12-MHz external input
    • 47 independently vectored peripheral interrupts
  • On-Chip Memory
    • 256K bytes reprogrammable Flash program memory
    • 8K bytes Flash data memory
    • 32K bytes of static RAM data memory
    • Addresses up to 12M bytes of external memory
  • Broad Range of Hardware Communications Peripherals
    • Bluetooth Lower Link Controller (LLC) including a shared 4.5K byte
      Bluetooth RAM and 1K byte Sequencer RAM
    • Universal Serial Bus (USB) 1.1 full-speed node
    • ACCESS.bus serial bus (compatible with Philips I2C bus)
    • CAN interface with 15 message buffers conforming to CAN specification
      2.0B active
    • 8/16-bit SPI, Microwire/Plus serial interface
    • Four-channel Universal Asynchronous Receiver/Transmitter (UART), one
      channel has USART capability
    • Advanced Audio Interface (AAI) to connect to external 8/ 13-bit PCM Codecs
      as well as to ISDN-Controllers through the IOM-2 interface (slave only)
    • CVSD/PCM converter supporting one bidirectional audio connection
  • General-Purpose Hardware Peripherals
    • 12-bit A/D Converter (ADC)
    • Dual 16-bit Multi-Function Timer (MFT)
    • Versatile Timer Unit with four subsystems (VTU)
    • Four-channel DMA controller
    • Timing and Watchdog Unit
    • Random Number Generator peripheral
  • Extensive Power and Clock Management Support
    • On-chip Phase Locked Loop
    • Support for multiple clock options
    • Dual clock and reset
    • Power-down modes
  • Flexible I/O
    • Up to 54 general-purpose I/O pins (shared with on-chip peripheral I/O)
    • Programmable I/O pin characteristics: TRI- STATE output, push-pull output,
      weak pull- up input, high-impedance input
    • Schmitt triggers on general-purpose inputs
    • Multi-Input Wake-Up (MIWU) capability
  • Power Supply
    • I/O port operation at 2.5V to 3.3V
    • Core logic operation at 2.5V
    • On-chip power-on reset
  • Temperature Range
    • –40°C to +85°C (Industrial)
  • Packages
    • LQFP-128, LQFP-144
  • Complete Development Environment
    • Pre-integrated hardware and software support for rapid prototyping and
      production
    • Integrated environment
    • Project manager
    • Multi-file C source editor
    • High-level C source debugger
    • Comprehensive, integrated, one-stop technical support
  • Bluetooth Protocol Stack
    • Applications can interface to the high-level protocols or directly to
      the low-level Host Controller Interface (HCI)
    • Transport layer support allows HCI command-based interface over UART port
    • Baseband (Link Controller) hardware minimizes the bandwidth demand on the CPU
    • Link Manager (LM)
    • Logical Link Control and Adaptation Protocol (L2CAP)
    • Service Discovery Protocol (SDP)
    • RFCOMM Serial Port Emulation Protocol
    • All packet types, piconet, and scatternet functionality supported

The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip SRAM and Flash memory provides high computing bandwidth, hardware communications peripherals provide high- I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (USB) 1.1 node, CAN, Microwire/Plus, SPI, ACCESS.bus, quad UART, 12-bit A/D converter, and Advanced Audio Interface (AAI). Additional on-chip peripherals include Random Number Generator (RNG), DMA controller, CVSD/PCM conversion module, Timing and Watchdog Unit, Versatile Timer Unit, Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

Bluetooth hand-held devices can be both smaller and lower in cost for maximum consumer appeal. The low voltage and advanced power-saving modes achieve new design points in the trade-off between battery size and operating time for handheld and portable applications.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3BT26 is backed up by the software resources designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with a Bluetooth radio transceiver such as TI’s LMX5252, the CP3BT26 provides a complete Bluetooth system solution.

Texas Instruments offers a complete and industry-proven application development environment for CP3BT26 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth Protocol Stack, and Application Software.

The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip SRAM and Flash memory provides high computing bandwidth, hardware communications peripherals provide high- I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (USB) 1.1 node, CAN, Microwire/Plus, SPI, ACCESS.bus, quad UART, 12-bit A/D converter, and Advanced Audio Interface (AAI). Additional on-chip peripherals include Random Number Generator (RNG), DMA controller, CVSD/PCM conversion module, Timing and Watchdog Unit, Versatile Timer Unit, Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

Bluetooth hand-held devices can be both smaller and lower in cost for maximum consumer appeal. The low voltage and advanced power-saving modes achieve new design points in the trade-off between battery size and operating time for handheld and portable applications.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3BT26 is backed up by the software resources designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with a Bluetooth radio transceiver such as TI’s LMX5252, the CP3BT26 provides a complete Bluetooth system solution.

Texas Instruments offers a complete and industry-proven application development environment for CP3BT26 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth Protocol Stack, and Application Software.

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* 数据表 CP3BT26 Repro Connectivity Processor w/Bluetooth, USB & CAN Interfaces 数据表 (Rev. D) 2013-12-23

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LQFP (PGE) 144 Ultra Librarian

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