TRF2001P
- 820MHz to 1054MHz RF front end module
- Transmit (TX):
- Saturated output power (PSAT): 27.5dBm (3.3V)
- PA gain: 24dB
- PAE: 42.2% at 27dBm
- HD2 / HD3: –56dBc / –70dBc
- Receive (RX) LNA:
- Gain: 16dB
- Noise figure (NF): 1.3dB
- IP1dB: –6.7dBm
- ANT to RX_FLT insertion loss: 1.5dB
- Integrated 50Ω RF match
- Integrated linear-in-dB power detector
- Supply voltage: 3.1V to 4.25V
- Total supply current at 3.3V:
- 360mA (TX PO = 27dBm)
- 65mA (TX, no RF)
- 10.3mA (RX only)
- Low sleep mode current: 0.05µA
- Operating ambient temperature range:–40°C to 85°C
The TRF2001P is a high-performance RF front-end module (FEM) for low-power wireless applications in sub-1GHz industrial, scientific, and medical (ISM) bands operating over an 820MHz to 1054MHz frequency range. The TRF2001P requires minimal external BOM and includes functions such as a range-extender power amplifier (PA) and a low noise amplifier (LNA), transmit-receive antenna switch, antenna port low pass filter, and a linear-in-dB RF power detector, for a cost-effective design in a space-saving 4.5mm × 4.5mm QFN-28 package.
The TRF2001P increases the link budget and allows range extension in wireless systems by providing high output power with the integrated PA, beyond the capabilities of a WMCU or transceiver, and improves the receiver sensitivity with a low noise figure LNA. The integrated power detector can be used for system calibration or to monitor the power being delivered to the antenna. The device features fully matched, 50Ω RF interfaces for ease of use and design flexibility.
The TRF2001P is operational over a wide, 3.1V to 4.25V supply range, with digital controls that are compatible with 1.6V to 3.3V CMOS logic levels.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | TRF2001P 820-1054MHz ISM Band Multiprotocol and Wi-SUN RF FEM 数据表 | PDF | HTML | 2025年 12月 2日 |
设计和开发
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| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| WQFN-FCRLF (VBA) | 28 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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