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TPA751

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采用 BGA 封装的 700mW 单声道、模拟输入 AB 类音频放大器

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TPA751

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产品详情

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.7 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.5 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.7 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.5 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Power Supply Rejection at 217 Hz
    • 84 dB at VDD = 5 V
    • 81 dB at VDD = 3.3 V
  • Output Power for RL = 8
    • 700 mW at VDD = 5 V
    • 250 mW at VDD = 3.3 V
  • Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP
    • MicroStar Junior™ (BGA)

PowerPAD and MicroStar Junior are trademarks of Texas Instruments.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Power Supply Rejection at 217 Hz
    • 84 dB at VDD = 5 V
    • 81 dB at VDD = 3.3 V
  • Output Power for RL = 8
    • 700 mW at VDD = 5 V
    • 250 mW at VDD = 3.3 V
  • Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP
    • MicroStar Junior™ (BGA)

PowerPAD and MicroStar Junior are trademarks of Texas Instruments.

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.
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类型 标题 下载最新的英语版本 日期
* 数据表 700-mW Mono Low-Voltage Audio Power Amplifier with Differential Inputs 数据表 (Rev. C) 2002年 10月 18日

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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