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TPA301

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350mW 单声道 AB 类音频放大器

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TPA301

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产品详情

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
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类型 标题 下载最新的英语版本 日期
* 数据表 TPA301: 350-mW Mono Audio Power Amplifier 数据表 (Rev. E) 2004年 6月 24日
应用手册 PowerPAD™ Thermally Enhanced Package (Rev. H) 2018年 7月 6日
用户指南 TPA301EVM - User Guide (Rev. A) 2001年 4月 17日

设计和开发

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评估板

TPA301EVM — TPA301 评估模块 (EVM)

A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.

用户指南: PDF
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子卡

BOOSTXL-AUDIO — 音频信号处理 BoosterPack 插件模块

插入 LaunchPad™ 开发套件时，BOOSTXL-AUDIO Audio BoosterPack™ 插件模块可从麦克风采集音频输入并通过板载扬声器输出音频。也支持耳机输入和输出。这种音频输入/输出流让开发人员能够对随附 LaunchPad 开发套件上微控制器 (MCU) 的数字信号处理 (DSP) 和滤波功能进行实验。

可通过多种方案（可通过 BoosterPack 上的跳线进行选择）将扬声器连接到 LaunchPad 的 MCU：(1) 通过 SPI 将音频数据输出到音频 BoosterPack 上提供的 SPI DAC；(2) 直接连接到 LaunchPad MCU 上的 (...)

用户指南: PDF
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仿真模型

TPA301 PSpice Model

SLOM361.ZIP (21 KB) - PSpice Model
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模拟工具

PSPICE-FOR-TI — PSpice® for TI 设计和仿真工具

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库，您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案，然后再进行布局和制造，可缩短产品上市时间并降低开发成本。 

在 PSpice for TI 设计和仿真工具中，您可以搜索 TI (...)
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参考设计

TIDM-VOICEBANDAUDIO — 采用 PWM DAC 的语音频带音频回放

此设计为低成本音频输出，基于生成 PWM 的计时器以及带放大器级的外部低通滤波器，适用于耳机或扬声器。音频数据存储在板载 SPI 闪存中。此设计提供含 Launchpad 直通代码的 PC GUI，用于向 SPI 闪存中加载音频数据。
设计指南: PDF
原理图: PDF
封装 引脚 CAD 符号、封装和 3D 模型
HVSSOP (DGN) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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