TMP9R01-SP
- QMLP, Radiation Hardness Assured (RHA)
- SMD 5962-17218:
- TID characterized up to 100krad(Si)
- TID RLAT/RHA to 100krad(Si)
- SEL immune to LET= 75MeV×cm2/mg at 125°C
- SEE characterized to LET= 75MeV×cm2/mg
- SEFI characterized to LET= 75MeV×cm2/mg
- QMLV version available: TMP461-SP
- Radiation Tolerant (Space Enhanced Plastic)
- Vendor item drawing (VID) V62/24615
- TID characterized up to 50krad(Si)
- TID RLAT/RHA to 30krad(Si)
- SEL immune to LET= 43MeV×cm2/mg at 125°C
- SEE characterized to LET= 43MeV×cm2/mg
- SEFI characterized to LET= 43MeV×cm2/mg
- Temperature accuracy and range:
- 12-bit resolution: 0.0625°C (LSB)
- Local (on-chip) temp accuracy: ±2.0°C (Max)
- Remote junction temp accuracy: ±1.5°C (Max)
- Remote range tested to: –64°C to 191°C
-
Military temperature range: -55 to 125°C
- Small-size package: VSSOP-10, 4.9mm × 3.0mm
- Integrated calibration/ protection features:
- η-factor and offset correction
- Series resistance cancellation
- Remote BJT/diode fault detection
- Programmable digital filter
- Wide operating range, low power:
- Voltage supply range: 1.7V to 3.6V
- I/O voltages: 1.8V, 2.5V, and 3.3V
- Standby/shutdown IQ: 15µA/3µA
The TMP9R01-SP (QML Class P) and TMP9R01-SEP (Radiation Tolerant, Space EP) are high-accuracy digital I2C temperature sensors integrating a 12-bit ADC, bias current sources, and calibration circuitry in a 10-pin VSSOP plastic package. The devices measure remote temperature by forcing a bias current through an external BJT or the integrated diode/junction of an FPGA, ADC, or ASIC, digitizing the resulting ΔVBE and reporting temperature with 0.0625°C resolution. An additional on-chip sensor provides local temperature measurement.
The TMP9R01-SP and TMP9R01-SEP incorporate multiple calibration and protection features, including series-resistance cancellation, programmable non-ideality factor (η-Factor), offset correction, and programmable digital filter. Designers can set high- and low-temperature limits that drive the ALERT output for over-and-under temperature thermal protection. Up to 9 pin-selectable I2C/SMBus addresses allow multiple sensors on the same I2C bus. The devices are designed for multi-location spacecraft housekeeping, satellite telemetry, avionics, and other high-reliability applications that require precise, temperature sensing and with varying levels of radiation hardness.
The TMP9R01-SP is also available as a functionally equivalent QMLV-RHA device: TMP461-SP.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TMP9R01-SP (QMLP RHA) and TMP9R01-SEP (Radiation Tolerant) Space-Grade, I2 C Digital Temperature Sensor With Remote and Local (On-Chip) Temperature Sensing 数据表 (Rev. A) | PDF | HTML | 2026年 7月 8日 | ||
| * | 辐射与可靠性报告 | TMP9R01-SP Plastic Neutron Displacement Damage (NDD) Characterization Report | 2026年 6月 22日 | |||
| * | 辐射与可靠性报告 | TMP9R01-SP Total Ionizing Dose (TID) Report | 2026年 6月 19日 | |||
| * | 辐射与可靠性报告 | TMP9R01-SP Single-Event Effects (SEE) Radiation Test Report (Rev. A) | PDF | HTML | 2025年 6月 17日 | ||
| 应用手册 | 如何优化航天级温度检测设计 | PDF | HTML | 英语版 | PDF | HTML | 2025年 11月 17日 | |
| 产品概述 | TI 航天级温度传感器产品选型指南 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2025年 1月 29日 |
设计与开发
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TMP9R01EVM — TMP9R01 评估模块
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| VSSOP (DGS) | 10 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点