TLC3555
- Very-low power consumption
- 1mW (typical) at VDD = 5V
- Astable operation up to 3MHz
- CMOS output capable of swinging rail to rail
- High-output-current capability
- Sink 200mA
- Source 50mA
- Output fully compatible with CMOS, TTL, and MOS logic
- Integrated RESET pullup to VDD
- Power-on reset to known state
- Integrated thermal shutdown protection
- Single-supply operation from 1.5V to 18V
The TLC3555 is a monolithic timing circuit fabricated using a TI CMOS process. The timer is fully compatible with CMOS, TTL, and MOS logic and operates at frequencies to 3MHz and even beyond. The TLC3555 improves upon the existing TLC555 from both a performance and feature standpoint, with tighter specification tolerances and additional features, such as thermal shutdown and power-on reset.
The trigger, threshold, and reset logic of the TLC3555 follow the same truth table as the TLC555. Set the reset pin (RESET) high for typical operation, or set the reset pin low to reset the flip-flop and force the output low. The TLC3555 features an internal pullup resistor from RESET to VDD, which can reduce passive count and save board area.
As a result of low propagation delay and rapid rise and fall times, the TLC3555 supports higher-frequency astable operation than previous timers such as the NE555 and TLC555. At a 15V supply, the TLC3555 achieves a clean square wave at 3.1MHz in TIs conventional astable test circuit. When used as an oscillator, with the output and inputs tied together, the TLC3555 achieves an oscillatory frequency of 7.2MHz. Circuit parasitics dominate the response at high frequencies. In addition to the D package, which is pin-to-pin compatible with the TLC555, the TLC3555 is offered in a DDF package that enables concise implementations with reduced parasitics.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TLC3555 High-Speed CMOS Timer 数据表 | PDF | HTML | 2026年 5月 19日 |
设计与开发
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|---|---|---|
| SOT-23-THN (DDF) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点