主页 接口 I2C & I3C ICs I2C & I3C level shifters, buffers & hubs

2 位双向 2.7V 至 5.5V 热插拔 400kHz I2C/SMBus 缓冲器

TCA4311 不推荐用于新设计
虽然我们会继续生产此产品供先前的设计使用,但不推荐在新设计中使用此产品。请考虑从这些替代产品中选择一款:
open-in-new 比较替代产品
功能与比较器件相似
TCA4311A 正在供货 2 位双向 2.7V 至 5.5V 热插拔 400kHz I2C/SMBus 缓冲器 The TCA4311A is a p2p replacement for the TCA4311. There are enhanced features related to the TCA4311A, making it most robust.

产品详情

Frequency (max) (MHz) 0.4 Rating Catalog Operating temperature range (°C) -40 to 85
Frequency (max) (MHz) 0.4 Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 8 29.4 mm² 4.9 x 6 VSSOP (DGK) 8 14.7 mm² 3 x 4.9
  • Operating Power-Supply Voltage Range of 2.7-V to 5.5-V
  • Supports Bidirectional Data Transfer of I2C Bus Signals
  • SDA and SCL Lines Are Buffered Which Increases Fanout
  • 1-V Precharge on All SDA and SCL Lines Prevents Corruption During Live Board Insertion and Removal From Backplane
  • SDA and SCL Input Lines Are Isolated From Outputs
  • Accommodates Standard Mode and Fast Mode I2C Devices
  • Applications Include Hot Board Insertion and Bus Extension
  • Low ICC Chip Disable of <1 μA
  • READY Open-Drain Output
  • Supports Clock Stretching, Arbitration, and Synchronization
  • Powered-Off High-Impedance I2C Pins
  • Open-Drain I2C Pins
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 8000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

All trademarks are the property of their respective owners.

  • Operating Power-Supply Voltage Range of 2.7-V to 5.5-V
  • Supports Bidirectional Data Transfer of I2C Bus Signals
  • SDA and SCL Lines Are Buffered Which Increases Fanout
  • 1-V Precharge on All SDA and SCL Lines Prevents Corruption During Live Board Insertion and Removal From Backplane
  • SDA and SCL Input Lines Are Isolated From Outputs
  • Accommodates Standard Mode and Fast Mode I2C Devices
  • Applications Include Hot Board Insertion and Bus Extension
  • Low ICC Chip Disable of <1 μA
  • READY Open-Drain Output
  • Supports Clock Stretching, Arbitration, and Synchronization
  • Powered-Off High-Impedance I2C Pins
  • Open-Drain I2C Pins
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 8000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

All trademarks are the property of their respective owners.

The TCA4311 is a hot swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock busses. Control circuitry prevents the backplane from being connected to the card until a stop command or bus idle occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are precharged to 1 V to minimize the current required to charge the parasitic capacitance of the chip.

When the I2C bus is idle, the TCA4311 can be put into shutdown mode by setting the EN pin low. When EN is high, the TCA4311 resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

Both the backplane and card may be powered with supply voltages ranging from 2.7 V to 5.5 V, with no restrictions on which supply voltage is higher.

The TCA4311 has standard open-drain I/Os. The size of the pullup resistors to the I/Os depends on the system, but each side of this buffer must have a pullup resistor. The device is designed to work with Standard Mode and Fast Mode I2C devices in addition to SMBus devices. Standard Mode I2C devices only specify 3 mA in a generic I2C system where Standard Mode devices and multiple masters are possible. Under certain conditions, high termination currents can be used.

The TCA4311 is a hot swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock busses. Control circuitry prevents the backplane from being connected to the card until a stop command or bus idle occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are precharged to 1 V to minimize the current required to charge the parasitic capacitance of the chip.

When the I2C bus is idle, the TCA4311 can be put into shutdown mode by setting the EN pin low. When EN is high, the TCA4311 resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

Both the backplane and card may be powered with supply voltages ranging from 2.7 V to 5.5 V, with no restrictions on which supply voltage is higher.

The TCA4311 has standard open-drain I/Os. The size of the pullup resistors to the I/Os depends on the system, but each side of this buffer must have a pullup resistor. The device is designed to work with Standard Mode and Fast Mode I2C devices in addition to SMBus devices. Standard Mode I2C devices only specify 3 mA in a generic I2C system where Standard Mode devices and multiple masters are possible. Under certain conditions, high termination currents can be used.

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类型 标题 下载最新的英语版本 日期
* 数据表 TCA4311 Hot Swappable 2-Wire Bus Buffers 数据表 (Rev. A) 2014年 6月 12日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

仿真模型

HSPICE Model for TCA4311

SCPJ002.ZIP (237 KB) - HSpice Model
仿真模型

TCA4311 IBIS Model

SCPM012.ZIP (44 KB) - IBIS Model
模拟工具

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用户指南: PDF
英语版 (Rev.A): PDF
封装 引脚 下载
SOIC (D) 8 查看选项
VSSOP (DGK) 8 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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