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SN74AUP1T57DCKR 正在供货

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数量 价格
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质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 NIPDAU
MSL 等级/回流焊峰值温度 Level-1-260C-UNLIM
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
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出口管制分类

*仅供参考

  • 美国 ECCN:EAR99

封装信息

封装 | 引脚 SOT-SC70 (DCK) | 6
工作温度范围 (°C) -40 to 85
包装数量 | 包装 3,000 | LARGE T&R

SN74AUP1T57 的特性

  • Available in the Texas Instruments NanoStar™ Packages
  • Single-Supply Voltage Translator
  • 1.8 V to 3.3 V (at VCC = 3.3 V)
  • 2.5 V to 3.3 V (at VCC = 3.3 V)
  • 1.8 V to 2.5 V (at VCC = 2.5 V)
  • 3.3 V to 2.5 V (at VCC = 2.5 V)
  • Nine Configurable Gate Logic Functions
  • Schmitt-Trigger Inputs Reject Input Noise and Provide Better
    Output Signal Integrity
  • Ioff Supports Partial-Power-Down Mode With Low Leakage Current (0.5 µA)
  • Very Low Static and Dynamic Power Consumption
  • Pb-Free Packages Available: SON (DRY or DSF), SOT-23 (DBV),
    SC-70 (DCK), and NanoStar WCSP
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Related Devices: SN74AUP1T58, SN74AUP1T97, and SN74AUP1T98

NanoStar is a trademark of Texas Instruments.

SN74AUP1T57 的说明

AUP technology is the industry’s lowest-power logic technology designed for use in battery-operated or battery backed-up equipment. The SN74AUP1T57 is designed for logic-level translation applications with input switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply.

The wide VCC range of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and ensures normal operation between this range.

Schmitt-trigger inputs (VT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.

The SN74AUP1T57 can be easily configured to perform a required gate function by connecting A, B, and C inputs to VCC or ground (see Function Selection table). Up to nine commonly used logic gate functions can be performed.

Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions.

The SN74AUP1T57 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs.

NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package.

定价

数量 价格
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包装类型

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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