SN74AUP1G79
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption:
ICC = 0.9 µA Maximum - Low Dynamic-Power Consumption:
Cpd = 3 pF Typical at 3.3 V - Low Input Capacitance:
Ci = 1.5 pF Typical - Low Noise: Overshoot and Undershoot
< 10% of VCC - Ioff Supports Partial Power-Down-Mode Operation
- Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity
at the Input
(Vhys = 250 mV Typical at 3.3 V) - Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
The AUP family is TIs premier solution to the industrys low-power needs in battery-powered portable applications. This family assures a very-low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, thus resulting in an increased battery life. The AUP devices also maintain excellent signal integrity.
The SN74AUP1G79 is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup-time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
The SN74AUP1G79 device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
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技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | SN74AUP1G79 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop 数据表 (Rev. I) | PDF | HTML | 2017-9-6 | ||
| 应用简报 | 了解施密特触发器 (Rev. B) | PDF | HTML | 英语版 (Rev.B) | PDF | HTML | 2025-5-5 | |
| 应用手册 | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022-12-15 | |||
| 应用手册 | Designing and Manufacturing with TI's X2SON Packages | 2017-8-23 |
设计与开发
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5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑评估模块
5-8-NL-LOGIC-EVM — 支持 5 至 8 引脚 DPW、DQE、DRY、DSF、DTM、DTQ 和 DTT 封装的通用逻辑和转换 EVM
通用 EVM 旨在支持采用 DTT、DRY、DPW、DTM、DQE、DQM、DSF 或 DTQ 封装的任何逻辑或转换器件。电路板设计可实现灵活的评估。
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| USON (DRY) | 6 | Ultra Librarian |
| SOT-23 (DBV) | 5 | Ultra Librarian |
| SOT-5X3 (DRL) | 5 | Ultra Librarian |
| X2SON (DSF) | 6 | Ultra Librarian |
| X2SON (DPW) | 5 | Ultra Librarian |
| SOT-SC70 (DCK) | 5 | Ultra Librarian |