可提供此产品的更新版本
功能与比较器件相同,但引脚排列有所不同
功能与比较器件相似
LM629
- 32-bit Position, Velocity, And Acceleration Registers
- Programmable Digital PID Filter with 16-bit Coefficients
- Programmable Derivative Sampling Interval
- 8- or 12-bit DAC Output Data (LM628)
- 8-bit Sign-magnitude PWM Output Data (LM629)
- Internal Trapezoidal Velocity Profile Generator
- Velocity, Target Position, and Filter Parameters may be Changed During Motion
- Position and Velocity Modes of Operation
- Real-time Programmable Host Interrupts
- 8-bit Parallel Asynchronous Host Interface
- Quadrature Incremental Encoder Interface with Index Pulse Input
- Available in a 28-pin Dual In-line Package or a SOIC-24 Package (LM629 Only)
All trademarks are the property of their respective owners.
The LM628/LM629 are dedicated motion-control processors designed for use with a variety of DC and brushless DC servo motors, and other servomechanisms which provide a quadrature incremental position feedback signal. The parts perform the intensive, real-time computational tasks required for high performance digital motion control. The host control software interface is facilitated by a high-level command set. The LM628 has an 8-bit output which can drive either an 8-bit or a 12-bit DAC. The components required to build a servo system are reduced to the DC motor/actuator, an incremental encoder, a DAC, a power amplifier, and the LM628. An LM629-based system is similar, except that it provides an 8-bit PWM output for directly driving H-switches. The parts are fabricated in NMOS and packaged in a 28-pin dual in-line package or a SOIC-24 package (LM629 only). Both 6 MHz and 8 MHz maximum frequency versions are available with the suffixes -6 and -8, respectively, used to designate the versions. They incorporate an SDA core processor and cells designed by SDA.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | LM628/LM629 Precision Motion Controller 数据表 (Rev. C) | 2013年 3月 22日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点