CDC319
- High-Speed, Low-Skew 1-to-10 Clock Buffer for SDRAM (Synchronous DRAM) Clock Buffering Applications
- Output Skew, tsk(o), Less Than 250 ps
- Pulse Skew, tsk(p), Less Than 500 ps
- Supports up to Two Unbuffered SDRAM DIMMs (Dual Inline Memory Modules)
- I2C Serial Interface Provides Individual Enable Control for Each Output
- Operates at 3.3 V
- Distributed VCC and Ground Pins Reduce Switching Noise
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015
- Packaged in 28-Pin Shrink Small Outline (DB) Package
The CDC319 is a high-performance clock buffer that distributes one input (A) to 10 outputs (Y) with minimum skew for clock distribution. The CDC319 operates from a 3.3-V power supply, and is characterized for operation from 0°C to 70°C.
The device provides a standard mode (100K-bits/s) I2C serial interface for device control. The implementation
is as a slave/receiver. The device address is specified in the I2C device address table. Both of the I2C inputs
(SDATA and SCLOCK) provide integrated pullup resistors (typically 140 k
) and are 5-V tolerant.
Three 8-bit I2C registers provide individual enable control for each of the outputs. All outputs default to enabled at powerup. Each output can be placed in a disabled mode with a low-level output when a low-level control bit is written to the control register. The registers are write only and must be accessed in sequential order (i.e., random access of the registers is not supported).
The CDC319 provides 3-state outputs for testing and debugging purposes. The outputs can be placed in a high-impedance state via the output-enable (OE) input. When OE is high, all outputs are in the operational state. When OE is low, the outputs are placed in a high-impedance state. OE provides an integrated pullup resistor.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | 1-Line To 10-Line Clock Driver 数据表 (Rev. A) | 2001年 10月 25日 |
设计和开发
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| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| SSOP (DB) | 28 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点