CD74HC297
- Digital Design Avoids Analog Compensation Errors
- Easily Cascadable for Higher Order Loops
- Useful Frequency Range
- K-Clock...DC to 55MHz (Typ)
- I/D-Clock...DC to 35MHz (Typ)
- Dynamically Variable Bandwidth
- Very Narrow Bandwidth Attainable
- Power-On Reset
- Output Capability
- Standard...XORPDOUT, ECPDOUT
- Bus Driver...I/DOUT
- Fanout (Over Temperature Range)
- Standard Outputs...10 LSTTL Loads
- Bus Driver Outputs...15 LSTTL Loads
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- ’HC297 Types
- Operation Voltage...2 to 6V
- High Noise Immunity NIL = 30%, NIH = 30% of VCC at 5V
- CD74HCT297 Types
- Operation Voltage...4.5 to 5.5V
- Direct LSTTL Input Logic Compatibility VIL =0.8V (Max), VIH =2V (Min)
- CMOS Input Compatibility II 1µA at VOL , VOH
Data sheet acquired from Harris Semiconductor
The HC297 and CD74HCT297 are high-speed silicon gate CMOS devices that are pin-compatible with low power Schottky TTL (LSTTL).
These devices are designed to provide a simple, cost-effective solution to high-accuracy, digital, phase-locked-loop applications. They contain all the necessary circuits, with the exception of the divide-by-N counter, to build first-order phase-locked-loops.
Both EXCLUSIVE-OR (XORPD) and edge-controlled phase detectors (ECPD) are provided for maximum flexibility. The input signals for the EXCLUSIVE-OR phase detector must have a 50% duty factor to obtain the maximum lock-range.
Proper partitioning of the loop function, with many of the building blocks external to the package, makes it easy for the designer to incorporate ripple cancellation (see Figure 2) or to cascade to higher order phase-locked-loops.
The length of the up/down K-counter is digitally programmable according to the K-counter function table. With A, B, C and D all LOW, the K-counter is disabled. With A HIGH and B, C and D LOW, the K-counter is only three stages long, which widens the bandwidth or capture range and shortens the lock time of the loop. When A, B, C and D are all programmed HIGH, the K-counter becomes seventeen stages long, which narrows the bandwidth or capture range and lengthens the lock time. Real-time control of loop bandwidth by manipulating the A to D inputs can maximize the overall performance of the digital phase-locked-loop.
The HC297 and CD74HCT297 can perform the classic first order phase-locked-loop function without using analog components. The accuracy of the digital phase-locked-loop (DPLL) is not affected by VCC and temperature variations but depends solely on accuracies of the K-clock and loop propagation delays.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | CD54/74HC297, CD74HCT297 数据表 (Rev. B) | 2003年 4月 16日 | |||
应用手册 | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 最新英语版本 (Rev.AB) | 2014年 11月 17日 | |||
用户指南 | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||||
用户指南 | Signal Switch Data Book (Rev. A) | 2003年 11月 14日 | ||||
应用手册 | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||||
应用手册 | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997年 6月 1日 | ||||
应用手册 | 使用逻辑器件进行设计 (Rev. C) | 1997年 6月 1日 | ||||
应用手册 | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||||
应用手册 | Live Insertion | 1996年 10月 1日 | ||||
应用手册 | SN54/74HCT CMOS Logic Family Applications and Restrictions | 1996年 5月 1日 | ||||
应用手册 | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996年 4月 1日 |
设计和开发
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14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑产品通用评估模块
14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
封装 | 引脚 | 下载 |
---|---|---|
PDIP (N) | 16 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点