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数字多路复用器和编码器

CD54AC157

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四路同向双输入多路复用器

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数据表

CD54AC157

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数据表 立即订购

产品详情

Technology family AC Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -55 to 125 Rating Military
Technology family AC Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 16 135.3552 mm² 19.56 x 6.92
  • AC Types Feature 1.5-V to 5.5-V Operation and Balanced Noise Immunity at 30% of the Supply Voltage
  • Speed of Bipolar F, AS, and S, With Significantly Reduced Power Consumption
  • Balanced Propagation Delays
  • ±24-mA Output Drive Current
    • Fanout to 15 F Devices
  • SCR-Latchup-Resistant CMOS Process and Circuit Design
  • Exceeds 2-kV ESD Protection Per MIL-STD-883, Method 3015
  • AC Types Feature 1.5-V to 5.5-V Operation and Balanced Noise Immunity at 30% of the Supply Voltage
  • Speed of Bipolar F, AS, and S, With Significantly Reduced Power Consumption
  • Balanced Propagation Delays
  • ±24-mA Output Drive Current
    • Fanout to 15 F Devices
  • SCR-Latchup-Resistant CMOS Process and Circuit Design
  • Exceeds 2-kV ESD Protection Per MIL-STD-883, Method 3015

These quadruple 2-line to 1-line data selectors/multiplexers are designed for 1.5-V to 5.5-V VCC operation.

The ’AC157 devices feature a common strobe (G)\ input. When the strobe is high, all outputs are low. When the strobe is low, a 4-bit word is selected from one of two sources and is routed to the four outputs. The devices provide true data.

These quadruple 2-line to 1-line data selectors/multiplexers are designed for 1.5-V to 5.5-V VCC operation.

The ’AC157 devices feature a common strobe (G)\ input. When the strobe is high, all outputs are low. When the strobe is low, a 4-bit word is selected from one of two sources and is routed to the four outputs. The devices provide true data.
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类型 标题 下载最新的英语版本 日期
* 数据表 CD54AC157, CD74AC157 数据表 2003年 3月 7日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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