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时钟和计时
实时时钟 (RTC) 和计时器

BQ3285

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具有 114x8 NVSRAM 的 RTC IC

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数据表

BQ3285

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数据表 立即订购

产品详情

Function Real-time clock Iq (typ) (mA) 0.0005 Features 0.114-kB memory density, Multiplexed bus interface, RAM clear function Rating Catalog Operating temperature range (°C) 0 to 70 Supply voltage (max) (V) 7 Supply voltage (min) (V) -0.3
Function Real-time clock Iq (typ) (mA) 0.0005 Features 0.114-kB memory density, Multiplexed bus interface, RAM clear function Rating Catalog Operating temperature range (°C) 0 to 70 Supply voltage (max) (V) 7 Supply voltage (min) (V) -0.3
SOIC (DW) 24 159.65 mm² 15.5 x 10.3
  • Direct clock/calendar replacement for IBM® AT-compatible computers and other applications
  • Functionally compatible with the DS1285
    • Closely matches MC146818A pin configuration
  • 114 bytes of general nonvolatile storage
  • 160ns cycle time allows fast bus operation
  • Selectable Intel or Motorola bus timing
  • Less than 0.5µA load under battery operation
  • 14 bytes for clock/calendar and control
  • BCD or binary format for clock and calendar data
  • Calendar in day of the week, day of the month, months, and years, with automatic leap-year adjustment
  • Time of day in seconds, minutes, and hours
    • 12- or 24-hour format
    • Optional daylight saving adjustment
  • Programmable square wave output
  • Three individually maskable interrupt event flags:
    • Periodic rates from 122us to 500ms
    • Time-of-day alarm once per second to once per day
    • End-of-clock update cycle
  • 24-pin plastic DIP or SOIC
  • Direct clock/calendar replacement for IBM® AT-compatible computers and other applications
  • Functionally compatible with the DS1285
    • Closely matches MC146818A pin configuration
  • 114 bytes of general nonvolatile storage
  • 160ns cycle time allows fast bus operation
  • Selectable Intel or Motorola bus timing
  • Less than 0.5µA load under battery operation
  • 14 bytes for clock/calendar and control
  • BCD or binary format for clock and calendar data
  • Calendar in day of the week, day of the month, months, and years, with automatic leap-year adjustment
  • Time of day in seconds, minutes, and hours
    • 12- or 24-hour format
    • Optional daylight saving adjustment
  • Programmable square wave output
  • Three individually maskable interrupt event flags:
    • Periodic rates from 122us to 500ms
    • Time-of-day alarm once per second to once per day
    • End-of-clock update cycle
  • 24-pin plastic DIP or SOIC

The CMOS bq3285 is a low-power microprocessor peripheral providing a time-of-day clock and 100-year calendar with alarm features and battery operation. Other features include three maskable interrupt sources, square wave output, and 114 bytes of general nonvolatile storage.

The bq3285 write-protects the clock, calendar, and storage registers during power failure. A backup battery then maintains data and operates the clock and calendar.

The bq3285 is a fully compatible real-time clock for IBM AT compatible computers and other applications. The only external components are a 32.768kHz crystal and a backup battery.

The CMOS bq3285 is a low-power microprocessor peripheral providing a time-of-day clock and 100-year calendar with alarm features and battery operation. Other features include three maskable interrupt sources, square wave output, and 114 bytes of general nonvolatile storage.

The bq3285 write-protects the clock, calendar, and storage registers during power failure. A backup battery then maintains data and operates the clock and calendar.

The bq3285 is a fully compatible real-time clock for IBM AT compatible computers and other applications. The only external components are a 32.768kHz crystal and a backup battery.
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类型 标题 下载最新的英语版本 日期
* 数据表 bq3285 - Real-Time Clock (RTC) 数据表 (Rev. A) 2004年 5月 26日
应用手册 U-502 Time-Base Oscillator for RTC IC 1999年 9月 5日
应用手册 U-503 Using the bq3285/7E in a Green or Portable Environment 1999年 9月 5日
应用手册 Using RAM Clear Function With bq3285/bq3287A RTCs 1999年 9月 5日

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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