ZHCSNC9B February   2021  – December 2021 TMUX7308F , TMUX7309F

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Thermal Information
   4. 7.4  Recommended Operating Conditions
   5. 7.5  Electrical Characteristics (Global)
   6. 7.6  ±15 V Dual Supply: Electrical Characteristics
   7. 7.7  ±20 V Dual Supply: Electrical Characteristics
   8. 7.8  12 V Single Supply: Electrical Characteristics
   9. 7.9  36 V Single Supply: Electrical Characteristics
   10. 7.10 Typical Characteristics
8. 8 Parameter Measurement Information
   1. 8.1  On-Resistance
   2. 8.2  Off-Leakage Current
   3. 8.3  On-Leakage Current
   4. 8.4  Input and Output Leakage Current Under Overvoltage Fault
   5. 8.5  Break-Before-Make Delay
   6. 8.6  Enable Delay Time
   7. 8.7  Transition Time
   8. 8.8  Fault Response Time
   9. 8.9  Fault Recovery Time
   10. 8.10 Charge Injection
   11. 8.11 Off Isolation
   12. 8.12 Crosstalk
   13. 8.13 Bandwidth
   14. 8.14 THD + Noise
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Flat On – Resistance
      2. 9.3.2 Protection Features
         1. 9.3.2.1 Input Voltage Tolerance
         2. 9.3.2.2 Powered-Off Protection
         3. 9.3.2.3 Fail-Safe Logic
         4. 9.3.2.4 Overvoltage Protection and Detection
         5. 9.3.2.5 Adjacent Channel Operation During Fault
         6. 9.3.2.6 ESD Protection
         7. 9.3.2.7 Latch-Up Immunity
         8. 9.3.2.8 EMC Protection
      3. 9.3.3 Bidirectional Operation
      4. 9.3.4 1.8 V Logic Compatible Inputs
      5. 9.3.5 Integrated Pull-Down Resistor on Logic Pins
   4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Fault Mode
      3. 9.4.3 Truth Tables
10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
       3. 10.2.3 Application Curves
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Documentation Support
       1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
14. 14Mechanical, Packaging, and Orderable Information