ZHCSNC9C february   2021  – july 2023 TMUX7308F , TMUX7309F

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Electrical Characteristics (Global)
    6. 7.6  ±15 V Dual Supply: Electrical Characteristics
    7. 7.7  ±20 V Dual Supply: Electrical Characteristics
    8. 7.8  12 V Single Supply: Electrical Characteristics
    9. 7.9  36 V Single Supply: Electrical Characteristics
    10. 7.10 Typical Characteristics
  9. Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Input and Output Leakage Current Under Overvoltage Fault
    5. 8.5  Break-Before-Make Delay
    6. 8.6  Enable Delay Time
    7. 8.7  Transition Time
    8. 8.8  Fault Response Time
    9. 8.9  Fault Recovery Time
    10. 8.10 Charge Injection
    11. 8.11 Off Isolation
    12. 8.12 Crosstalk
    13. 8.13 Bandwidth
    14. 8.14 THD + Noise
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Flat On – Resistance
      2. 9.3.2 Protection Features
        1. 9.3.2.1 Input Voltage Tolerance
        2. 9.3.2.2 Powered-Off Protection
        3. 9.3.2.3 Fail-Safe Logic
        4. 9.3.2.4 Overvoltage Protection and Detection
        5. 9.3.2.5 Adjacent Channel Operation During Fault
        6. 9.3.2.6 ESD Protection
        7. 9.3.2.7 Latch-Up Immunity
        8. 9.3.2.8 EMC Protection
      3. 9.3.3 Bidirectional Operation
      4. 9.3.4 1.8 V Logic Compatible Inputs
      5. 9.3.5 Integrated Pull-Down Resistor on Logic Pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Fault Mode
      3. 9.4.3 Truth Tables
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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订购信息

EMC Protection

The TMUX7308F and TMUX7309F are not intended for standalone electromagnetic compatibility (EMC) protection in industrial applications. There are three common high voltage transient specifications that govern industrial high voltage transient specification: IEC61000-4-2 (ESD), IEC61000-4-4 (EFT), and IEC61000-4-5 (surge immunity). A transient voltage suppressor (TVS), along with some low-value series current limiting resistor, are required to prevent source input voltages from going above the rated ±60 V limits.

When selecting a TVS protection device, it is critical to ensure that the maximum working voltage is greater than both the normal operating range of the input source pins to be protected and any known system common-mode overvoltage that may be present due to incorrect wiring, loss of power, or short circuit. Figure 9-2 shows one example of the proper design window when selecting a TVS device.

Region 1 denotes the normal operation region of TMUX7308F and TMUX7309F where the input source voltages stay below the fault supplies VDD and VSS. Region 2 represents the range of possible persistent DC (or long duration AC overvoltage fault) presented on the source input pins. Region 3 represents the margin between any known DC overvoltage level and the absolute maximum rating of the TMUX7308F and TMUX7309F. The selected TVS breakdown voltage must be less than the absolute maximum rating of the TMUX730xF but greater than any known possible persistent DC or long duration AC overvoltage fault to avoid triggering the TVS inadvertently. Region 4 represents the margin that system designers must impose when selecting the TVS protection device to prevent accidental triggering of the ESD cells of the TMUX7308F and TMUX7309F devices.

GUID-FD58C086-69E4-4CC6-93E2-787DDF131139-low.gifFigure 9-2 System Operation Regions and Proper Region of Selecting a TVS Protection Device