ZHCSRZ2B April 2023 – December 2025 ESD451
PRODUCTION DATA
| 参数 | 封装 | 测试条件 | 最小值 | 典型值 | 最大值 | 单位 | |
|---|---|---|---|---|---|---|---|
| VRWM | 反向关断电压 | DPL 和 DPY 封装 | IIO < 100nA,在工作温度范围内 | -5.5 | 5.5 | V | |
| ILEAK | 反向漏电流 | VIO = 5.5V,IO 至 GND 或 GND 至 IO | 5 | 50 | nA | ||
| VBR | 击穿电压 | IIO = 1mA,IO 至 GND | 7 | 8 | 9 | V | |
| VCLAMP | 使用 TLP 时的钳位电压 | DPL 封装 | IPP = 1A,TLP,IO 至 GND | 7.6 | V | ||
| IPP = 5A,TLP,IO 至 GND | 8.2 | ||||||
| IPP = 16A,TLP,IO 至 GND | 10.4 | ||||||
| IPP = 1A,TLP,GND 至 IO | 7.6 | ||||||
| IPP = 5A,TLP,GND 至 IO | 8.2 | ||||||
| IPP = 16A,TLP,GND 至 IO | 10.4 | ||||||
| 浪涌冲击的钳位电压 (3) | IPP = 6A,tp = 8/20µs,IO 至 GND | 9.5 | |||||
| IPP = 6A,tp = 8/20µs,GND 至 IO | 9.5 | ||||||
| RDYN | 动态电阻 (2) | IO 至 GND | 0.19 | Ω | |||
| GND 至 IO | 0.19 | ||||||
| VCLAMP | 使用 TLP 时的钳位电压 | DPY 封装 | IPP = 1A,TLP,IO 至 GND | 8.2 | V | ||
| IPP = 5A,TLP,IO 至 GND | 9.2 | ||||||
| IPP = 16A,TLP,IO 至 GND | 11.5 | ||||||
| IPP = 1A,TLP,GND 至 IO | 8.2 | ||||||
| IPP = 5A,TLP,GND 至 IO | 9.2 | ||||||
| IPP = 16A,TLP,GND 至 IO | 11.5 | ||||||
| 浪涌冲击的钳位电压 (3) | IPP = 6A,tp = 8/20µs,IO 至 GND | 10 | |||||
| IPP = 6A,tp = 8/20µs,GND 至 IO | 10 | ||||||
| RDYN | 动态电阻 (2) | IO 至 GND | 0.24 | Ω | |||
| GND 至 IO | 0.24 | ||||||
| CL | 线路电容 | DPL 和 DPY 封装 | VIO = 0V;ƒ = 1MHz,Vpp = 30mV,IO 至 GND 或 IO 至 GND | 0.5 | pF | ||