ZHCSR57G October   1985  – April 2025 SN75179B

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2说明
  4. 3Pin Configuration and Functions
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics: Driver
    5. 4.5 Switching Characteristics
    6. 4.6 Symbol Equivalent
    7. 4.7 Electrical Characteristics: Receiver
    8. 4.8 Switching Characteristics
    9. 4.9 Typical Characteristics
  6. 5Parameter Measurement Information
  7. 6Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 接收文档更新通知
    3. 7.3 支持资源
    4. 7.4 Trademarks
    5. 7.5 静电放电警告
    6. 7.6 术语表
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

4.3 Thermal Information

THERMAL METRIC(1) SOIC (D) PDIP (P) SOP (PS) UNIT
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 116.7 109.5 84.3 °C/W

RθJC(top)

 Junction-to-case (top) thermal resistance 56.3 53.9 65.4

RθJB

 Junction-to-board thermal resistance 63.4 65.7 62.1
ψJT Junction-to-top characterization parameter 8.8 11.6 31.3
ψJB Junction-to-board characterization parameter 62.6 64.5 60.4
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.