ZHCSPI9A December   2021  – December 2022 OPT4001

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Matching to Human Eye
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Output Register CRC and Counter
        1. 8.3.3.1 Output Sample Counter
        2. 8.3.3.2 Output CRC
      4. 8.3.4 Output Register FIFO
      5. 8.3.5 Threshold Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
      2. 8.4.2 Interrupt Modes of Operation
      3. 8.4.3 Light Range Selection
      4. 8.4.4 Selecting Conversion Time
      5. 8.4.5 Light Measurement in Lux
      6. 8.4.6 Light Resolution
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Overview
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Serial Interface
      2. 8.5.2 Writing and Reading
        1. 8.5.2.1 High-Speed I2C Mode
        2. 8.5.2.2 Burst Read Mode
        3. 8.5.2.3 General-Call Reset Command
        4. 8.5.2.4 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 ALL Register Map
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Electrical Interface
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Optical Interface
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optomechanical Design (PicoStar Variant)
          2. 9.2.1.2.2 Optomechanical Design (SOT-5X3 Variant)
        3. 9.2.1.3 Application Curves (PicoStar Variant)
    3. 9.3 Do's and Don'ts
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
        1. 9.5.2.1 Soldering and Handling Recommendations (SOT-5X3 Variant)
        2. 9.5.2.2 Soldering and Handling Recommendations (PicoStar Variant)
          1. 9.5.2.2.1 Solder Paste
          2. 9.5.2.2.2 Package Placement
          3. 9.5.2.2.3 Reflow Profile
          4. 9.5.2.2.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
          5. 9.5.2.2.5 Rework Process
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

Do's and Don'ts

As with any optical product, take special care when handling the OPT4001. In case of the PicoStar™ variant, the device is a piece of active silicon, without the mechanical protection of an epoxy-like package or other reinforcement. This design allows the device to be as thin as possible. Take extra care to handle the device gently to not crack or break the device. Use a properly-sized vacuum manipulation tool to handle the device.

Generally for both package variants, the optical surface of the device must be kept clean for the best performance, both when prototyping with the device, and during mass production manufacturing procedures. Keep the optical surface clean of fingerprints, dust, and other optical-inhibiting contaminants.

If the optical surface of the device requires cleaning, then use a few gentle brushes with a soft swab of deionized water or isopropyl alcohol. Avoid potentially abrasive cleaning and manipulating tools and excessive force that can scratch the optical surface.

If the OPT4001 performs less than excellent, then inspect the optical surface for dirt, scratches, or other optical artifacts.