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  • TMS320F2806x 实时微控制器

    • ZHCS009J November   2010  – September 2021 TMS320F28062 , TMS320F28062-Q1 , TMS320F28062F , TMS320F28062F-Q1 , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28066-Q1 , TMS320F28067 , TMS320F28067-Q1 , TMS320F28068F , TMS320F28068M , TMS320F28069 , TMS320F28069-Q1 , TMS320F28069F , TMS320F28069F-Q1 , TMS320F28069M , TMS320F28069M-Q1

      PRODUCTION DATA  

  • CONTENTS
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  • TMS320F2806x 实时微控制器
  1. 1 特性
  2. 2 应用
  3. 3 说明
    1. 3.1 功能方框图
    2. 3.2 系统器件图
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings – Commercial
    3. 7.3  ESD Ratings – Automotive
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Consumption Summary
      1. 7.5.1 TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT
      2. 7.5.2 Reducing Current Consumption
      3. 7.5.3 Current Consumption Graphs (VREG Enabled)
    6. 7.6  Electrical Characteristics
    7. 7.7  Thermal Resistance Characteristics
      1. 7.7.1 PFP PowerPAD Package
      2. 7.7.2 PZP PowerPAD Package
      3. 7.7.3 PN Package
      4. 7.7.4 PZ Package
    8. 7.8  Thermal Design Considerations
    9. 7.9  Debug Probe Connection Without Signal Buffering for the MCU
    10. 7.10 Parameter Information
      1. 7.10.1 Timing Parameter Symbology
      2. 7.10.2 General Notes on Timing Parameters
    11. 7.11 Test Load Circuit
    12. 7.12 Power Sequencing
      1. 7.12.1 Reset ( XRS) Timing Requirements
      2. 7.12.2 Reset ( XRS) Switching Characteristics
    13. 7.13 Clock Specifications
      1. 7.13.1 Device Clock Table
        1. 7.13.1.1 2806x Clock Table and Nomenclature (90-MHz Devices)
        2. 7.13.1.2 Device Clocking Requirements/Characteristics
        3. 7.13.1.3 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
      2. 7.13.2 Clock Requirements and Characteristics
        1. 7.13.2.1 XCLKIN Timing Requirements – PLL Enabled
        2. 7.13.2.2 XCLKIN Timing Requirements – PLL Disabled
        3. 7.13.2.3 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    14. 7.14 Flash Timing
      1. 7.14.1 Flash/OTP Endurance for T Temperature Material
      2. 7.14.2 Flash/OTP Endurance for S Temperature Material
      3. 7.14.3 Flash/OTP Endurance for Q Temperature Material
      4. 7.14.4 Flash Parameters at 90-MHz SYSCLKOUT
      5. 7.14.5 Flash/OTP Access Timing
      6. 7.14.6 Flash Data Retention Duration
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1  CPU
      2. 8.1.2  Control Law Accelerator (CLA)
      3. 8.1.3  Viterbi, Complex Math, CRC Unit (VCU)
      4. 8.1.4  Memory Bus (Harvard Bus Architecture)
      5. 8.1.5  Peripheral Bus
      6. 8.1.6  Real-Time JTAG and Analysis
      7. 8.1.7  Flash
      8. 8.1.8  M0, M1 SARAMs
      9. 8.1.9  L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs
      10. 8.1.10 Boot ROM
        1. 8.1.10.1 Debug Boot
        2. 8.1.10.2 GetMode
        3. 8.1.10.3 Peripheral Pins Used by the Bootloader
      11. 8.1.11 Security
      12. 8.1.12 Peripheral Interrupt Expansion (PIE) Block
      13. 8.1.13 External Interrupts (XINT1 to XINT3)
      14. 8.1.14 Internal Zero Pin Oscillators, Oscillator, and PLL
      15. 8.1.15 Watchdog
      16. 8.1.16 Peripheral Clocking
      17. 8.1.17 Low-power Modes
      18. 8.1.18 Peripheral Frames 0, 1, 2, 3 (PFn)
      19. 8.1.19 General-Purpose Input/Output (GPIO) Multiplexer
      20. 8.1.20 32-Bit CPU-Timers (0, 1, 2)
      21. 8.1.21 Control Peripherals
      22. 8.1.22 Serial Port Peripherals
    2. 8.2 Memory Maps
    3. 8.3 Register Maps
    4. 8.4 Device Debug Registers
    5. 8.5 VREG, BOR, POR
      1. 8.5.1 On-chip VREG
        1. 8.5.1.1 Using the On-chip VREG
        2. 8.5.1.2 Disabling the On-chip VREG
      2. 8.5.2 On-chip Power-On Reset (POR) and Brownout Reset (BOR) Circuit
    6. 8.6 System Control
      1. 8.6.1 Internal Zero Pin Oscillators
      2. 8.6.2 Crystal Oscillator Option
      3. 8.6.3 PLL-Based Clock Module
      4. 8.6.4 USB and HRCAP PLL Module (PLL2)
      5. 8.6.5 Loss of Input Clock (NMI Watchdog Function)
      6. 8.6.6 CPU Watchdog Module
    7. 8.7 Low-power Modes Block
    8. 8.8 Interrupts
      1. 8.8.1 External Interrupts
        1. 8.8.1.1 External Interrupt Electrical Data/Timing
          1. 8.8.1.1.1 External Interrupt Timing Requirements
          2. 8.8.1.1.2 External Interrupt Switching Characteristics
    9. 8.9 Peripherals
      1. 8.9.1  CLA Overview
      2. 8.9.2  Analog Block
        1. 8.9.2.1 Analog-to-Digital Converter (ADC)
          1. 8.9.2.1.1 Features
          2. 8.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing
            1. 8.9.2.1.2.1 External ADC Start-of-Conversion Switching Characteristics
          3. 8.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
            1. 8.9.2.1.3.1 ADC Electrical Characteristics
            2. 8.9.2.1.3.2 ADC Power Modes
            3. 8.9.2.1.3.3 Internal Temperature Sensor
              1. 8.9.2.1.3.3.1 Temperature Sensor Coefficient
            4. 8.9.2.1.3.4 ADC Power-Up Control Bit Timing
              1. 8.9.2.1.3.4.1 ADC Power-Up Delays
            5. 8.9.2.1.3.5 ADC Sequential and Simultaneous Timings
        2. 8.9.2.2 ADC MUX
        3. 8.9.2.3 Comparator Block
          1. 8.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing
            1. 8.9.2.3.1.1 Electrical Characteristics of the Comparator/DAC
      3. 8.9.3  Detailed Descriptions
      4. 8.9.4  Serial Peripheral Interface (SPI) Module
        1. 8.9.4.1 SPI Master Mode Electrical Data/Timing
          1. 8.9.4.1.1 SPI Master Mode External Timing (Clock Phase = 0)
          2. 8.9.4.1.2 SPI Master Mode External Timing (Clock Phase = 1)
        2. 8.9.4.2 SPI Slave Mode Electrical Data/Timing
          1. 8.9.4.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
          2. 8.9.4.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 8.9.5  Serial Communications Interface (SCI) Module
      6. 8.9.6  Multichannel Buffered Serial Port (McBSP) Module
        1. 8.9.6.1 McBSP Electrical Data/Timing
          1. 8.9.6.1.1 McBSP Transmit and Receive Timing
            1. 8.9.6.1.1.1 McBSP Timing Requirements
            2. 8.9.6.1.1.2 McBSP Switching Characteristics
          2. 8.9.6.1.2 McBSP as SPI Master or Slave Timing
            1. 8.9.6.1.2.1 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. 8.9.6.1.2.2 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. 8.9.6.1.2.3 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. 8.9.6.1.2.4 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. 8.9.6.1.2.5 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. 8.9.6.1.2.6 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. 8.9.6.1.2.7 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. 8.9.6.1.2.8 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      7. 8.9.7  Enhanced Controller Area Network (eCAN) Module
      8. 8.9.8  Inter-Integrated Circuit (I2C)
        1. 8.9.8.1 I2C Electrical Data/Timing
          1. 8.9.8.1.1 I2C Timing Requirements
          2. 8.9.8.1.2 I2C Switching Characteristics
      9. 8.9.9  Enhanced Pulse Width Modulator (ePWM) Modules (ePWM1 to ePWM8)
        1. 8.9.9.1 ePWM Electrical Data/Timing
          1. 8.9.9.1.1 ePWM Timing Requirements
          2. 8.9.9.1.2 ePWM Switching Characteristics
        2. 8.9.9.2 Trip-Zone Input Timing
          1. 8.9.9.2.1 Trip-Zone Input Timing Requirements
      10. 8.9.10 High-Resolution PWM (HRPWM)
        1. 8.9.10.1 HRPWM Electrical Data/Timing
          1. 8.9.10.1.1 High-Resolution PWM Characteristics
      11. 8.9.11 Enhanced Capture Module (eCAP1)
        1. 8.9.11.1 eCAP Electrical Data/Timing
          1. 8.9.11.1.1 Enhanced Capture (eCAP) Timing Requirement
          2. 8.9.11.1.2 eCAP Switching Characteristics
      12. 8.9.12 High-Resolution Capture Modules (HRCAP1 to HRCAP4)
        1. 8.9.12.1 HRCAP Electrical Data/Timing
          1. 8.9.12.1.1 High-Resolution Capture (HRCAP) Timing Requirements
      13. 8.9.13 Enhanced Quadrature Encoder Modules (eQEP1, eQEP2)
        1. 8.9.13.1 eQEP Electrical Data/Timing
          1. 8.9.13.1.1 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
          2. 8.9.13.1.2 eQEP Switching Characteristics
      14. 8.9.14 JTAG Port
      15. 8.9.15 General-Purpose Input/Output (GPIO) MUX
        1. 8.9.15.1 GPIO Electrical Data/Timing
          1. 8.9.15.1.1 GPIO Output Timing
            1. 8.9.15.1.1.1 General-Purpose Output Switching Characteristics
          2. 8.9.15.1.2 GPIO Input Timing
            1. 8.9.15.1.2.1 General-Purpose Input Timing Requirements
          3. 8.9.15.1.3 Sampling Window Width for Input Signals
          4. 8.9.15.1.4 Low-Power Mode Wakeup Timing
            1. 8.9.15.1.4.1 IDLE Mode Timing Requirements
            2. 8.9.15.1.4.2 IDLE Mode Switching Characteristics
            3. 8.9.15.1.4.3 STANDBY Mode Timing Requirements
            4. 8.9.15.1.4.4 STANDBY Mode Switching Characteristics
            5. 8.9.15.1.4.5 HALT Mode Timing Requirements
            6. 8.9.15.1.4.6 HALT Mode Switching Characteristics
      16. 8.9.16 Universal Serial Bus (USB)
        1. 8.9.16.1 USB Electrical Data/Timing
          1. 8.9.16.1.1 USB Input Ports DP and DM Timing Requirements
          2. 8.9.16.1.2 USB Output Ports DP and DM Switching Characteristics
  9. 9 Applications, Implementation, and Layout
    1. 9.1 TI Reference Design
  10. 10Device and Documentation Support
    1. 10.1 Device and Development Support Tool Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information
  12. 重要声明
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DATA SHEET

TMS320F2806x 实时微控制器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 高效 32 位 CPU (TMS320C28x)
    • 90MHz（11.11ns 周期时间）
    • 16 × 16 和 32 × 32 乘法和累加 (MAC) 运算
    • 16 × 16 双 MAC
    • 哈佛 (Harvard) 总线架构
    • 连动运算
    • 快速中断响应和处理
    • 统一存储器编程模型
    • 高效代码（使用 C/C++ 和汇编语言）
  • 浮点单元 (FPU)
    • 原生单精度浮点运算
  • 可编程控制律加速器 (CLA)
    • 32 位浮点数学加速器
    • 独立于主 CPU 之外的代码执行
  • Viterbi、复杂数学、CRC 单元 (VCU)
    • 扩展了 C28x 指令集以支持复杂的乘法、Viterbi 运算和循环冗余校验 (CRC)
  • 嵌入式存储器
    • 高达 256KB 的闪存
    • 高达 100KB 的随机存取存储器 (RAM)
    • 2KB 一次性可编程 (OTP) ROM
  • 6 通道直接内存存取 (DMA)
  • 低器件和系统成本
    • 3.3V 单电源
    • 无需电源排序
    • 集成型加电复位和欠压复位
    • 低功耗操作模式
    • 无模拟支持引脚
  • 字节序：小端字节序
  • 支持 JTAG 边界扫描
    • IEEE 标准 1149.1-1990 标准测试访问端口和边界扫描架构
  • 计时
    • 两个内部零引脚振荡器
    • 片载晶体振荡器/外部时钟输入
    • 看门狗计时器模块
    • 丢失时钟检测电路
  • 可支持所有外设中断的外设中断扩展 (PIE) 模块
  • 三个 32 位 CPU 计时器
  • 高级控制外设
  • 多达 8 个增强型脉冲宽度调制器 (ePWM) 模块
    • 总共 16 个 PWM 通道（可支持 8 个 HRPWM）
    • 每个模块中的独立 16 位计时器
  • 3 个输入增强型捕捉 (eCAP) 模块
  • 多达 4 个高分辨率捕捉 (HRCAP) 模块
  • 多达 2 个增强型正交编码器脉冲 (eQEP) 模块
  • 12 位模数转换器 (ADC)，具有双路采样保持 (S/H) 功能
    • 高达 3.46MSPS
    • 高达 16 通道
  • 片上温度传感器
  • 128 位安全密钥和锁
    • 保护安全内存块
    • 防止固件逆向工程
  • 串行端口外设
    • 两个串行通信接口 (SCI) [UART] 模块
    • 两个串行外设接口 (SPI) 模块
    • 一条内部集成电路 (I2C) 总线
    • 一个多通道缓冲串行端口 (McBSP) 总线
    • 一个增强型控制器局域网络 (eCAN)
    • 通用串行总线 (USB) 2.0
      （关于可用性，请参阅器件比较表）
      • 全速器件模式
      • 全速或低速主机模式
  • 多达 54 个具有输入滤波功能的独立可编程、多路复用通用输入/输出 (GPIO) 引脚
  • 高级调试特性
    • 分析和断点功能
    • 通过硬件进行实时调试
  • 封装选项
    • 80 引脚 PFP 和 100 引脚 PZP PowerPAD™ 耐热增强型薄型四方扁平封装 (HTQFP)
    • 80 引脚 PN 和 100 引脚 PZ 薄型四方扁平封装 (LQFP)
  • 温度选项
    • T：–40°C 至 105°C
    • S：–40°C 至 125°C
    • Q：–40°C 至 125°C 的环境温度范围（通过针对汽车应用的 AEC Q100 认证）

2 应用

  • 空调室外机
  • 电梯门自动启闭装置驱动控制
  • 逆变器和电机控制
  • 车载充电器 (OBC) 和无线充电器
  • 自动分拣设备
  • CNC 控制
  • 纺织机
  • 焊接机
  • 电动汽车充电站电源模块
  • 车辆无线充电模块
  • 能量存储电源转换系统 (PCS)
  • 中央逆变器
  • 微型逆变器
  • 太阳能电源优化器
  • 串式逆变器
  • 交流驱动器控制模块
  • 交流驱动器功率级模块
  • 线性电机功率级
  • 伺服驱动器控制模块
  • 伺服驱动器功率级模块
  • 交流输入 BLDC 电机驱动器
  • 直流输入 BLDC 电机驱动器
  • 工业交流-直流
  • 三相 UPS

3 说明

C2000™ 32 位微控制器针对处理、感应和驱动进行了优化，可提高实时控制应用（如工业电机驱动器、光伏逆变器和数字电源、电动汽车和运输、电机控制以及感应和信号处理）的闭环性能。C2000 系列包括高级性能 MCU 和入门级性能 MCU。

F2806x 系列微控制器 (MCU) 为 C28x 内核以及与引脚较少的器件中高度集成的控制外设耦合的 CLA 供电。该系列器件的代码与基于 C28x 的旧版代码兼容，同时具有较高的模拟集成度。

一个内部稳压器实现了单电源轨运行。对 HRPWM 模块实施了改进，以提供双边缘控制 （调频）。器件内还新增了采用 10 位内部基准的模拟比较器，可通过与其直接相连来控制 ePWM 输出。ADC 可在 0V 至 3.3V 的固定满量程范围内实施转换，支持 VREFHI/VREFLO 基准的比例运算。ADC 接口已针对低开销和延迟进行了优化。

如需详细了解 C2000 MCU，请访问“C2000 概述”，地址为 www.ti.com/c2000。

器件信息
器件型号(1) 封装 封装尺寸
TMS320F28069PZP HTQFP (100) 14.0mm × 14.0mm
TMS320F28069PFP HTQFP (80) 12.0mm x 12.0mm
TMS320F28069PZ LQFP (100) 14.0mm x 14.0mm
TMS320F28069PN LQFP (80) 12.0mm × 12.0mm
(1) 如需这些器件的详细信息，请参阅机械、封装和可订购信息。

3.1 功能方框图

图 3-1 显示器件的功能方框图。

GUID-3CFE0A3B-317D-48F1-9FA7-49317B9808B2-low.gif
由于引脚复用，所有外设引脚不能同时使用。
图 3-1 功能方框图

3.2 系统器件图

GUID-41F95423-8FD5-49CC-A40E-4D6EC3751544-low.gif图 3-2 外设块

4 Revision History

Changes from February 1, 2021 to May 30, 2021 (from Revision I (February 2021) to Revision J (May 2021))

  • 全局更改：将“仿真”更新/更改为“调试”Go
  • 添加了 Q1 器件型号Go
  • Updated/changed from "SCI" to "SCI/UART"Go
  • Updated/changed Device Compairson table footnote to show correct part numbersGo
  • Updated/changed the definition for VREGENZGo
  • Updated/changed oscillator footnoteGo
  • Updated/changed Security noteGo
  • Updated/changed Peripheral Frame informationGo
  • Added a row for Instaspin featureGo
  • Updated/changed image, Clock Tree, to remove WDCLK labelGo
  • Updated/changed "CPU Watchdog Module" to remove WDCLKGo
  • Added C2000 third-party search tool linkGo

5 Device Comparison

Table 5-1 lists the features of the TMS320F2806x devices.

Table 5-1 Device Comparison
FEATURE TYPE(1) 28069
28069-Q1
28069U(2)(5)
28069M(2)(3)
28069M-Q1
28069F(2)(3)
28069F-Q1
(90 MHz)		 28068U(2)(5)
28068M(2)(3)
28068F(2)(3)
(90 MHz)		 28067
28067-Q1
28067U(2)(5)
(90 MHz)		 28066
28066-Q1
28066U(2)(5)
(90 MHz)		 28065
28065-Q1
28065U(2)(5)
(90 MHz)		 28064
28064U(2)(5)
(90 MHz)		 28063
28063U(2)(5)
(90 MHz)		 28062
28062-Q1
28062U(2)(5)
28062F(2)(3)
28062F-Q1
(90 MHz)
Package Type
(PFP and PZP are PowerPAD HTQFPs.
PN and PZ are LQFPs.)		 100-Pin
PZ
PZP		 80-Pin
PN
PFP		 100-Pin
PZ
PZP		 80-Pin
PN
PFP		 100-Pin
PZ
PZP		 80-Pin
PN
PFP		 100-Pin
PZ
PZP		 80-Pin
PN
PFP		 100-Pin
PZ
PZP		 80-Pin
PN
PFP		 100-Pin
PZ
PZP		 80-Pin
PN
PFP		 100-Pin
PZ
PZP		 80-Pin
PN
PFP		 100-Pin
PZ
PZP		 80-Pin
PN
PFP
Instruction cycle – 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns
Floating-Point Unit (FPU) Yes Yes Yes Yes Yes Yes Yes Yes
VCU Yes Yes No No Yes Yes No No
CLA 0 Yes No No No Yes No No No
6-Channel DMA 0 Yes Yes Yes Yes Yes Yes Yes Yes
On-chip Flash (16-bit word) – 128K 128K 128K 128K 64K 64K 64K 64K
On-chip SARAM (16-bit word) – 50K 50K 50K 34K 50K 50K 34K 26K
Code security for on-chip Flash, SARAM, and OTP blocks – Yes Yes Yes Yes Yes Yes Yes Yes
Boot ROM (32K × 16) – Yes Yes Yes Yes Yes Yes Yes Yes
One-time programmable (OTP) ROM
(16-bit word)		 – 1K 1K 1K 1K 1K 1K 1K 1K
ePWM channels 1 16 14 16 14 16 14 16 14 16 14 16 14 16 14 16 14
High-resolution ePWM Channels 1 8 8 8 8 8 8 8 8
eCAP inputs 0 3 3 3 3 3 3 3 3
HRCAP 0 4 1 4 1 4 1 4 1 4 1 4 1 4 1 4 1
eQEP modules 0 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1
Watchdog timer – Yes Yes Yes Yes Yes Yes Yes Yes
12-Bit ADC MSPS 3 3.46 3.46 3.46 3.46 3.46 3.46 3.46 3.46
Conversion Time 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns
Channels 16 12 16 12 16 12 16 12 16 12 16 12 16 12 16 12
Temperature Sensor Yes Yes Yes Yes Yes Yes Yes Yes
Dual Sample-and-Hold Yes Yes Yes Yes Yes Yes Yes Yes
32-Bit CPU timers – 3 3 3 3 3 3 3 3
Comparators with Integrated DACs 0 3 3 3 3 3 3 3 3
I2C 0 1 1 1 1 1 1 1 1
McBSP 1 1 1 1 1 1 1 1 1
eCAN 0 1 1 1 1 1 1 1 1
SPI 1 2 2 2 2 2 2 2 2
SCI/UART 0 2 2 2 2 2 2 2 2
USB 0 1(2) 1(2) 1(2) 1(2) 1(2) 1(2) 1(2) 1(2)
2-pin Oscillator 1 1 1 1 1 1 1 1
0-pin Oscillator 2 2 2 2 2 2 2 2
I/O pins (shared) GPIO – 54 40 54 40 54 40 54 40 54 40 54 40 54 40 54 40
AIO – 6 6 6 6 6 6 6 6
External interrupts – 3 3 3 3 3 3 3 3
Supply voltage (nominal) – 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Temperature options T: –40°C to 105°C – PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN
S: –40°C to 125°C – PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP
Q: –40°C to 125°C(5)(4) – PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP
(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the basic functionality of the module. These device-specific differences are listed in the C2000 Real-Time Control Peripherals Reference Guide and in the peripheral reference guides.
(2) USB is present on TMS320F2806xU, TMS320F2806xM, and TMS320F2806xF devices.
(3) TMS320F2806xF devices are InstaSPIN-FOC™-enabled MCUs. TMS320F2806xM devices are InstaSPIN-MOTION™-enabled MCUs. But instaSPIN-MOTION is no longer recommended for new designs and will not have application support. For more information, see Section 10.3 for a list of InstaSPIN Technical Reference Manuals.
(4) The letter Q refers to AEC Q100 qualification for automotive applications.
(5) The Q temperature option is not available on the TMS320F2806xU devices.

5.1 Related Products

For information about similar products, see the following links:

TMS320F2802x Microcontrollers
The F2802x series offers the lowest pin-count and Flash memory size options. InstaSPIN-FOC™ versions are available.

TMS320F2803x Microcontrollers
The F2803x series increases the pin-count and memory size options. The F2803x series also introduces the parallel control law accelerator (CLA) option.

TMS320F2805x Microcontrollers
The F2805x series is similar to the F2803x series but adds on-chip programmable gain amplifiers (PGAs). InstaSPIN-FOC and InstaSPIN-MOTION™ versions are available.

TMS320F2806x Microcontrollers
The F2806x series is the first to include a floating-point unit (FPU). The F2806x series also increases the pin-count, memory size options, and the quantity of peripherals. InstaSPIN-FOC™ and InstaSPIN-MOTION™ versions are available.

TMS320F2807x Microcontrollers
The F2807x series offers the most performance, largest pin counts, flash memory sizes, and peripheral options. The F2807x series includes the latest generation of accelerators, ePWM peripherals, and analog technology.

TMS320F28004x Microcontrollers
The F28004x series is a reduced version of the F2807x series with the latest generational enhancements. The F28004x series is the best roadmap option for those using the F2806x series. InstaSPIN-FOC and configurable logic block (CLB) versions are available.

6 Terminal Configuration and Functions

 
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