STDA032 June   2026 TDA54-Q1

 

  1.   1
  2.   Abstract
  3. 1Introduction
  4. 2Market Trends
    1. 2.1 Embedded Autonomy
    2. 2.2 AI Integration
    3. 2.3 Edge Compute
  5. 3Addressing These Challenges
    1. 3.1 Operating Systems and Ecosystem Diversity
    2. 3.2 Security and Functional Safety
    3. 3.3 AI Compute
    4. 3.4 Board Enablement
    5. 3.5 User Experience
    6. 3.6 Scalability
    7. 3.7 Lifecycle Flexibility
  6. 4Maintaining a Competitive Advantage

Board Enablement

Note that software engineers must have a comprehensive understanding of end equipment and peripheral components to deploy successful applications. For example, engineers must use power modes to compensate for thermal limits, power optimization tools where battery life is limited and develop custom drivers for interfacing with board components from different suppliers. TI invests significant resources into high-performance SoCs to meet the many needs of successful PCBs. Complementary configuration and optimization tools are readily available for components such as DDR, ISP, pins (pinmuxing), clocks and power. In the TDA4 and TDA5 product lines, mainline drivers for PMICs, serializers, ADCs and analog technology are supported regardless of supplier, meaning engineers can incorporate non-TI components into a system.