SPVA022 July   2025 SN65176B , SN75176B

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 Motivation
  6. 3 Feature
  7. 4 Cover Tape Peeling Strength
  8. 5 Electrostatic Charges
  9. 6 Multi-Row Carrier Tape Design
  10. 7 Device Name Nomenclature
  11. 8 What I Need to do on my SMT Equipment?
  12. 9 Conclusion
  13. 10Additional Resources

2 Motivation

As you continue to navigate the ever-changing landscape of the SMT industry, it is essential that you prioritize cost reduction as a vital component, improve storage strategy, and reduce packing material and costs. This can unlock significant benefits including increased packing and SMT tool utilization through reduced changeover, driving the industry forward and ensuring long-term success.

Using the SOIC 8D as an example, the standard packing quantity (SPQ) for traditional single-row tape and reel is 2500 units. The corresponding outer box has a height of 36mm. In contrast, the new multi-row method is able to increases the packing density, allowing the SPQ to be boosted to 7500 units, while the outer box height is only marginally increased to 42mm, as illustrated in Figure 2-1. This results in a significant reduction in box volume of 66% for SOIC 8D. Furthermore, shipping efficiency is greatly improved due to the substantial decrease in total shipping volume.

Traditional Single Row Method of SOIC 8D Requires Three Boxes to Meet the Same QTY of Multi-Row Figure 2-1 Traditional Single Row Method of SOIC 8D Requires Three Boxes to Meet the Same QTY of Multi-Row