SPVA022 July   2025 SN65176B , SN75176B

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. Introduction
  5. Motivation
  6. Feature
  7. Cover Tape Peeling Strength
  8. Electrostatic Charges
  9. Multi-Row Carrier Tape Design
  10. Device Name Nomenclature
  11. What I Need to do on my SMT Equipment?
  12. Conclusion
  13. 10Additional Resources

Feature

  • Multiple rows number available: 3 rows for SOIC 8D and TSSOP 8/14/16PW packages. More rows might be available in the future.
  • Carrier tape width: 24mm for SOIC 8D and TSSOP 8/14/16PW packages.
  • Texas Instrument tape and reel specifications are in conformance with the EIA Standard 481 "Taping of Surface-Mount Components for Automatic Placement.
  • The reel is made of polystyrene (PS) plastic material and topically coated with antistatic solution.
  • The carrier tape is made of standard polycarbonate or polystyrene materials.
  • The cover tape is made of polyester material.
  • The cover tape uses pressure sensitive or heat activated adhesive.