Abstract

Today's electronics shipping methods include Tray, Tube, and Tape and Reel. Among these major types, tape and reel is the most widely used method, particularly for high-volume production, due to its high speed, precise placement in automated pick-and-place machines, and ESD protection. As a result, tape and reel has become the preferred method for packaging a wide range of electronics, including ICs, passive components, terminals, modules, bare dies, and heat sinks. However, the traditional tape and reel packing method has some drawbacks, such as underutilized packing density, significant storage space requirements, and frequent changeovers. To support the rapid growth of the semiconductor industry, a more efficient method is needed to pack and ship electronic components to our customer factories.

This technical white paper introduces a groundbreaking, industry-first packing method: multi-row tape and reel. This document discusses how the innovative multi-row design addresses storage and shipping challenges, why it is crucial for the industry, and how to successfully adopt this technology in your factory.